FS660R08A6P2FLB分立半导体产品的晶体管-IGBT-模块规格书PDF中文资料

FS660R08A6P2FLB属于分立半导体产品的晶体管-IGBT-模块。由英飞凌科技股份公司制造生产的FS660R08A6P2FLB晶体管 - IGBT - 模块绝缘栅双极晶体管 (IGBT) 是三端功率半导体器件，主要用作电子开关，兼具高效率和快速切换优点。作为模块，IGBT 配置为非对称式桥； 升压、降压和制动斩波器；全桥、三电平和三相逆变器。有些器件内置了用于监控温度的 NTC 热敏电阻。IGBT 模块可根据最大功率、集电极电流、集射击穿电压和配置进行区分。

Electrical Features

•Blocking voltage 750V

•Low VCEsat

•Low Switching Losses

•Low Qg and Crss

•Low Inductive Design

•Tvj op = 150°C

•Short-time extended Operation Temperature

Tvj op = 175°C

Mechanical Features

•4.2kV DC 1sec Insulation

•High Creepage and Clearance Distances

•Compact design

•High Power Density

•Copper Base Plate

•Guiding elements for PCB and cooler assembly

•Integrated NTC temperature sensor

•PressFIT Contact Technology

•RoHS compliant

•UL 94 V0 module frame

描述 Description

The HybridPACKTM Drive is a very compact

six-pack module optimized for hybrid and electric

vehicles. The product FS660R08A6P2FLB comes

with a flat baseplate and is a 750V/660A module

derivate within the HybridPACK Drive family. The

power module implements the new EDT2 IGBT

generation, which is an automotive Micro-Pattern

Trench-Field-Stop cell design optimized for electric

drive train applications. The chipset has benchmark

current density combined with short circuit

ruggedness and increased blocking voltage for

reliable inverter operation under harsh

environmental conditions. The EDT2 IGBTs also

show excellent light load power losses, which helps

to improve system efficiency over a real driving

cycle. The EDT2 IGBT was optimized for

applications with switching frequencies in the range

of 10 kHz.

The new The HybridPACKTM Drive power module

family comes with mechanical guiding elements

supporting easy assembly processes for customers.

Furthermore, the press-fit pins for the signal

terminals avoid additional time consuming selective

solder processes, which provides cost savings on

system level and increases system reliability. The

two products in the The HybridPACKTM Drive family

with flat baseplate in the FS660R08A6P2FLB and

PinFin baseplate in the FS820R08A6P2LB allow a

very cost effective scaling for different inverter

power levels at a minimum inverter design effort.