FS50R12U1T4数据手册分立半导体产品的晶体管-IGBT-模块规格书PDF

描述 Description

1200V  SmartPACK1 IGBT module with trench/fieldstop IGBT4, Emitter Controlled Diode4, NTC and PressFIT Contact Technology

特性 Features

·Low Switching Losses
·Low V CEsat
·Trench IGBT4
·V CEsat with positive Temperature Coefficient
·Al 2O 3 Substrate with Low Thermal Resistance
·Rugged Duplex frame construction
·Rugged selfacting PressFIT assembly

应用 Application

     FS50R12U1T4Data Sheet (2 MB, EN/CN)EN/DEEN/JAParametricFS50R12U1T4Configuration SixpackIC(nom) / IF(nom)  50.0A VCE(sat)(Tvj=25°C typ) 1.85V VF(Tvj=25°C typ) 1.7V Housing SmartPACK 1Dimensions(width) 44.0mm Dimensions(length) 69.5mm Data SheetTitleSizeDateVersionFS50R12U1T4 (chinese/english)EN/CNEN/DEEN/JA2 MB10 十一月 201403_00Product BrochureTitleSizeDateVersion1EDI EiceDRIVER™ Compact 300 milEN216 KB09 五月 201601_00Application NotesTitleSizeDateVersionIndustrial IGBT Modules Explanation of Technical InformationENJA2.2 MB03 十二月 201501_02利用单极栅电压驱动IGBTCNEN384 KB03 十一月 201501_00等效热路模型CNEN500 KB25 十一月 2013Application of screen print templates to paste thermal grease within IGBT modulesEN489 KB10 二月 2014Series connection of IGBTsEN28 KB10 二月 2014电力电子模块内部NTC的使用CNEN586 KB26 十一月 2013如何正确计算并最大限度减小 IGBT 的死区时间CNEN1.5 MB26 八月 2013Aging stability of various heatconducting pastes for use with modules without baseplatesEN111 KB10 二月 2014Assembly Instructions Smart1 ModulesENDE1.5 MB22 十月 2009Application Note IGBT Definition of Junction TemperatureEN84 KB09 四月 2009Paralleling of IGBTsEN28 KB10 二月 2014Product BriefTitleSizeDateVersionSmartPIM and SmartPACK - Self-acting PressFIT assemblyEN168 KB27 四月 201606_00EditorialsTitleSizeDateVersionCorrelating NTC-Reading and Chip-Temperature in Power Electronic ModulesEN297 KB04 十一月 201501_00Self acting PressFIT moduleEN624 KB31 一月 2011The challenge of accurately analyzing thermal resistancesEN1.1 MB31 五月 20141200V IGBT4 -High Power- a new Technology Generation with Optimized Characteristics for High Current ModulesEN141 KB07 二月 2014Comparison between active and passive thermal cycling stress with respect to substrate solder reliability in IGBT modules with Cu baseplatesEN704 KB31 五月 2014Application BrochureTitleSizeDateVersionSolutions for Industrial DrivesEN3.4 MB15 五月 201710_00Solutions for Uninterruptible Power Supply (UPS) SystemsEN3.4 MB15 五月 201709_00Product Selection GuideTitleSizeDateVersionSelection Guide - Industrial and general purpose gate driver ICsEN3.5 MB15 五月 201701_00Product CatalogueTitleSizeDateVersionShort Form Catalog - May 2017EN2.9 MB12 五月 201703_00销售产品名称FS50R12U1T4OPNFS50R12U1T4BPSA1产品状态not for new design在线订购封装名称AG-SMART1-1无铅产品no无卤no通过无铅认证yes包装规格30包装类型TRAY评估板评估板系列描述状态2ED300E17-SFOGate Driver, IGBT ModulesThis evaluation board for the 2ED300C17-S / -ST IGBT driver boards can be used for all medium and high power IGBT modules up to 1700V.·For equipping EiceDRIVER™ 2ED300C17-S / -ST

简介

FS50R12U1T4属于分立半导体产品的晶体管-IGBT-模块。由制造生产的FS50R12U1T4晶体管 - IGBT - 模块绝缘栅双极晶体管 (IGBT) 是三端功率半导体器件，主要用作电子开关，兼具高效率和快速切换优点。作为模块，IGBT 配置为非对称式桥； 升压、降压和制动斩波器；全桥、三电平和三相逆变器。有些器件内置了用于监控温度的 NTC 热敏电阻。IGBT 模块可根据最大功率、集电极电流、集射击穿电压和配置进行区分。