Double Side Cooled Module

Electrical Features • Increased Blocking Voltage Capability to 700V • Integrated Current Sensor • Low Inductive Design • Tvj op = 150°C Mechanical Features • 2.5kV AC 1min Insulation • Double sided cooling • Compact design • RoHS compliant • Integrated NTC temperature sensor

文件：1.06918 Mbytes 页数：14 Pages

Infineon

英飞凌

HybridPACKª Light Module

Electrical Features • Increased blocking voltage capability to 705V • Low Switching Losses • Tvj op = 150°C • Trench IGBT 3 • VCEsat with positive Temperature Coefficient Mechanical Features • 2.5 kV AC 1min Insulation • Al2O3 Substrate with Low Thermal Resistance • High mechanical robu

文件：1.43133 Mbytes 页数：14 Pages

Infineon

英飞凌

EasyPACK™ module with TRENCHSTOP™IGBT7 and emitter controlled 7 diode and PressFIT / NTC

Features • Electrical features - VCES = 950 V - IC nom = 200 A / ICRM = 300 A - Low VCE,sat - Tvj,op = 150°C - TRENCHSTOPTM IGBT7 • Mechanical features - Al2O3 substrate with low thermal resistance - High power and thermal cycling capability - Integrated NTC temperature sensor - PressFI

文件：626.9 Kbytes 页数：14 Pages

Infineon

英飞凌

EiceDRIVER™ 1ED314xMU12F (1ED-X3 Compact)

Features • Single-channel isolated gate driver • For use with 600 V/650 V/1200 V/1700 V/2300 V IGBTs, Si and SiC MOSFETs • Up to 6.5 A typical peak output current • 45 ns propagation delay with 7 ns part-to-part matching (skew) • 35 V absolute maximum output supply voltage • High common-mode

文件：4.24411 Mbytes 页数：34 Pages

Infineon

英飞凌

EconoPACK™3 Modul mit Trench/Feldstopp IGBT4 und Emitter Controlled 4 Diode und NTC / bereits aufgetragenem Thermal Interface Material

Electrical Features • Low switching losses • Low VCEsat • Tvj op = 150°C • VCEsat with positive temperature coefficient Mechanical Features • High power and thermal cycling capability • Integrated NTC temperature sensor • Copper base plate • PressFIT contact technology • Standard housi

文件：655.62 Kbytes 页数：9 Pages

Infineon

英飞凌

EconoPACK™3 module with TRENCHSTOP™IGBT7 and emitter controlled 7 diode and NTC

Features • Electrical features - VCES = 1200 V - IC nom = 200 A / ICRM = 400 A - Low VCE,sat - Overload operation up to 175°C - TRENCHSTOPTM IGBT7 • Mechanical features - Integrated NTC temperature sensor - High power and thermal cycling capability - Solder contact technology - Al2O3 su

文件：456.08 Kbytes 页数：16 Pages

Infineon

英飞凌

EasyPACK™ module with TRENCHSTOP™IGBT7 and emitter controlled 7 diode and PressFIT / NTC

Features • Electrical features - VCES = 1200 V - IC nom = 200 A / ICRM = 400 A - Low VCE,sat - Overload operation up to 175°C - TRENCHSTOPTM IGBT7 • Mechanical features - Al2O3 substrate with low thermal resistance - Copper base plate - High power and thermal cycling capability - Integr

文件：607.41 Kbytes 页数：15 Pages

Infineon

英飞凌

FlashStation FS2017

Highlights • 90K 4K Random Write IOPS1, high performance with low latency • Intel Xeon 8-core CPU and 16GB DDR4 ECC RDIMM, expandable up to 128GB • Dual onboard 10GBase-T ports, capable of installing optional 10GbE / 25GbE / 40GbE NICs • Complete virtualization solution for VMware, Window

文件：551.91 Kbytes 页数：5 Pages

SYNOLOGY

群晖科技

20.0 Ampere Surface Mount Dual Common Anode Ultra Fast Recovery Rectifiers

Features ※ ThinkiSemi latest&matured process FRD/FRED ※ Low forward voltage drop ※ High current capability ※ Low reverse leakage current ※ High surge current capability Application ※ Automotive Inverters and Solar Inverters ※ Car Audio Amplifiers and Sound Device Systems ※ Plating Power S

文件：309.48 Kbytes 页数：2 Pages

THINKISEMI

思祁半导体

20.0 Ampere Surface Mount Dual Common Anode Ultra Fast Recovery Rectifiers

Features ※ ThinkiSemi latest&matured process FRD/FRED ※ Low forward voltage drop ※ High current capability ※ Low reverse leakage current ※ High surge current capability Application ※ Automotive Inverters and Solar Inverters ※ Car Audio Amplifiers and Sound Device Systems ※ Plating Power S

文件：309.48 Kbytes 页数：2 Pages

THINKISEMI

思祁半导体