Plastic-Encapsulate MOSFETS

DESCRIPTION The uses advanced trench technology to provide excellent RDS(ON) and low gate charge. This device is suitable for use as a load switch or in PWM applications. FQ4800Q

文件：383.75 Kbytes 页数：4 Pages

GWSEMI

唯圣电子

Mini size of Discrete semiconductor elements

文件：468.13 Kbytes 页数：10 Pages

ETCList of Unclassifed Manufacturers

未分类制造商

CONTROL DEVICES Planar Beamlead - PIN Diodes

文件：131.3 Kbytes 页数：2 Pages

MICROSEMI

美高森美

Thin Type Infrared Emitting Diode

■ Features 1. Thin type (Thickness : 1.5mm ) 2. Beam angle ( ∆θ : TYP. ± 30˚) 3. Radiant flux (Φ e : MIN. 0.7mW at I F = 20mA) 4. Epoxy resin package ■ Applications 1. Floppy disk drives 2. Optoelectronic switches

文件：33.64 Kbytes 页数：3 Pages

SHARPSharp Corporation

夏普