Ultrafast Plastic Rectifier

FEATURES • Glass passivated chip junction • Ultrafast recovery time • Low switching losses, high efficiency • Low leakage current • High forward surge capability • Meets MSL level 1, per J-STD-020, LF maximum peak of 245 °C (for TO-263AB package) • Solder dip 260 °C, 40 s (for TO-220AC and

文件：143.69 Kbytes 页数：5 Pages

VishayVishay Siliconix

威世科技

Package：TO-263-3，D²Pak（2 引线 + 接片），TO-263AB；包装：管件 类别：分立半导体产品 二极管 - 整流器 - 单 描述：DIODE GEN PURP 600V 8A TO263AB

Vishay General Semiconductor - Diodes Division

Ultrafast Plastic Rectifier

FEATURES • Glass passivated chip junction • Ultrafast recovery time • Low switching losses, high efficiency • Low leakage current • High forward surge capability • Meets MSL level 1, per J-STD-020, LF maximum peak of 245 °C (for TO-263AB package) • Solder dip 260 °C, 40 s (for TO-220AC and

文件：143.69 Kbytes 页数：5 Pages

VishayVishay Siliconix

威世科技

High Voltage Ultrafast Rectifier

FEATURES • Glass passivated chip junction • Ultrafast recovery time • Soft recovery characteristics • Low switching losses, high efficiency • High forward surge capability • Meets MSL level 1, per J-STD-020, LF maximum peak of 245 °C (for TO-263AB package) • Solder dip 260 °C,

文件：144.25 Kbytes 页数：5 Pages

VishayVishay Siliconix

威世科技

High Voltage Ultrafast Rectifier

文件：142.81 Kbytes 页数：5 Pages

VishayVishay Siliconix

威世科技