MULTILAYER CHIP BEAD

●FEATURE 1. Small size chips generating high impedance 2. High reliability due to an entirely monolithic structure 3. Low DC resistance structure of electrode prevents wasteful electric power consumption 4. Suppress EMI/RFI and to prevent self-oscillation in electronic products ●APPLICATION

文件：167.9 Kbytes 页数：3 Pages

AITSEMI

创瑞科技

EMI SOLOTION PRODUCTS-RoHS

文件：64.47 Kbytes 页数：3 Pages

FENGJUI

峰瑞科技

SMD

TAIYO

上传：君宇国际实业有限公司

BGA

SPECTEK

上传：深圳市富芯乐电子科技有限公司

TSOP48

SPECTEK

上传：深圳市潼睿电子科技有限公司