包装：盒 功能：比较器 类别：开发板，套件，编程器 评估和演示板及套件 描述：BOARD EVALUATION ADCMP564BRQZ

AD

亚德诺

T-1 3/4 PACKAGE SOLID STATE LAMP

Description The MVL-564B, a blue source color device, is made with InGaN ( on SiC substrate) LED die. The package is T-1 3/4( 5mm) water clear plastic lens package. Features High performance - 2.5mW (470nm) Superior SiC substrate technology Excellent chip to chip consistency Hi

文件：44.83 Kbytes 页数：2 Pages

UOT

东贝光电

T-1 3/4 ( f 5mm) PACKAGE SOLID STATE LAMP PRELIMINARY

Description The MVL-564SG, a green source color device, is made with InGaN ( on SiC substrate) LED die. The package is T-1 3/4 (ф5mm) water clear plastic Features • High performance - 2.0mW (505nm) • Superior SiC substrate technology • Excellent chip to chip consistency • High reliability A

文件：45.42 Kbytes 页数：2 Pages

UOT

东贝光电

T-1 3/4 ( f 5mm) PACKAGE SOLID STATE LAMP

Description The MVL-564TG, a green source color device, is made with InGaN ( on SiC substrate) LED die. The package is T-1 3/4 (ф 5mm) water clear plastic type. Features • High performance - 1.5mW (525nm) • Superior SiC substrate technology • Excellent chip to chip consistency • High reliabi

文件：33.29 Kbytes 页数：2 Pages

UOT

东贝光电