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型号	下载订购	功能描述	制造商上传企业	LOGO
ESM-CFH	文件：814.6 Kbytes Page：2 Pages	PICMG COM R3.0 Type 6 module, Intel® 9th/8th Gen Xeon®/ Core™ i7/i5/i3 Processors with CM246/QM370 Chipset Features • PICMG COM R3.0 Type 6 module with 9th/8th Generation Intel® Xeon®/Core™ i7 / i5 / i3 Processors • Up to 3 x 260-pin DDR4 non-ECC/ECC 2400/2133 SODIMM with up to 96 GB • Dual-channel 18/24-bit LVDS, VGA, DP++/HDMI/DVI, optional eDP • Flexible I/O support with 4 x USB3.2 Gen.2, 8 x USB 文件：814.6 Kbytes 页数：2 Pages	BCM	BCM
ESM-CFH-2276ME	文件：814.6 Kbytes Page：2 Pages	PICMG COM R3.0 Type 6 module, Intel® 9th/8th Gen Xeon®/ Core™ i7/i5/i3 Processors with CM246/QM370 Chipset Features • PICMG COM R3.0 Type 6 module with 9th/8th Generation Intel® Xeon®/Core™ i7 / i5 / i3 Processors • Up to 3 x 260-pin DDR4 non-ECC/ECC 2400/2133 SODIMM with up to 96 GB • Dual-channel 18/24-bit LVDS, VGA, DP++/HDMI/DVI, optional eDP • Flexible I/O support with 4 x USB3.2 Gen.2, 8 x USB 文件：814.6 Kbytes 页数：2 Pages	BCM	BCM
ESM-CFH-8400H	文件：814.6 Kbytes Page：2 Pages	PICMG COM R3.0 Type 6 module, Intel® 9th/8th Gen Xeon®/ Core™ i7/i5/i3 Processors with CM246/QM370 Chipset Features • PICMG COM R3.0 Type 6 module with 9th/8th Generation Intel® Xeon®/Core™ i7 / i5 / i3 Processors • Up to 3 x 260-pin DDR4 non-ECC/ECC 2400/2133 SODIMM with up to 96 GB • Dual-channel 18/24-bit LVDS, VGA, DP++/HDMI/DVI, optional eDP • Flexible I/O support with 4 x USB3.2 Gen.2, 8 x USB 文件：814.6 Kbytes 页数：2 Pages	BCM	BCM
ESM-CFH-9100HL	文件：814.6 Kbytes Page：2 Pages	PICMG COM R3.0 Type 6 module, Intel® 9th/8th Gen Xeon®/ Core™ i7/i5/i3 Processors with CM246/QM370 Chipset Features • PICMG COM R3.0 Type 6 module with 9th/8th Generation Intel® Xeon®/Core™ i7 / i5 / i3 Processors • Up to 3 x 260-pin DDR4 non-ECC/ECC 2400/2133 SODIMM with up to 96 GB • Dual-channel 18/24-bit LVDS, VGA, DP++/HDMI/DVI, optional eDP • Flexible I/O support with 4 x USB3.2 Gen.2, 8 x USB 文件：814.6 Kbytes 页数：2 Pages	BCM	BCM
ESM-CFH-9850HE	文件：814.6 Kbytes Page：2 Pages	PICMG COM R3.0 Type 6 module, Intel® 9th/8th Gen Xeon®/ Core™ i7/i5/i3 Processors with CM246/QM370 Chipset Features • PICMG COM R3.0 Type 6 module with 9th/8th Generation Intel® Xeon®/Core™ i7 / i5 / i3 Processors • Up to 3 x 260-pin DDR4 non-ECC/ECC 2400/2133 SODIMM with up to 96 GB • Dual-channel 18/24-bit LVDS, VGA, DP++/HDMI/DVI, optional eDP • Flexible I/O support with 4 x USB3.2 Gen.2, 8 x USB 文件：814.6 Kbytes 页数：2 Pages	BCM	BCM

供应商	型号	品牌	批号	封装	库存	备注	价格
现代芯城（深圳）科技有限公司	ESMC-M-12-SGR-SMT-T/R		24+	N/A	58000	一级代理-主营优势-实惠价格-不悔选择	询价
深圳市原品电子科技有限公司	ESMC-M-12-SGS-SMT-A-PP-T/R	Adam Tech	23+	CONN	20	全新、原装	询价
深圳市和悦电子贸易有限公司	ESMCM16SGSSMTAPPT	ADAM TECH			50000		询价

更多ESM-CFH供应商更新时间2025-12-10 11:06:00

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