丝印：ES1J；Package：DO-214AC；Surface Mount Super Fast Recifier Diodes ES1A Through ES1K

FEATURES Low profile package Ideal for automated placement Glass passivated chip junction High forward surge capability Super Fast reverse recovery time Meets MSL level 1, per J-STD-020, LF maximum peak of 260 °C

文件：1.08034 Mbytes 页数：3 Pages

RFE

RFE international

丝印：ES1J；Package：SMA；Surface Mount Superfast Recovery Rectifier

Features For surface mounted applications Low profile package Glass Passivated Chip Junction Superfast reverse recovery time Lead free in comply with EU RoHS 2011/65/EU directives

文件：2.32931 Mbytes 页数：4 Pages

UNSEMI

优恩半导体

丝印：ES1J；Package：SMAF；Surface Mount Superfast Recovery Rectifier

Features For surface mounted applications Low profile package Glass passivated chip junction Superfast reverse recovery time Lead free in comply with EU RoHS 2011/65/EU directives

文件：2.36198 Mbytes 页数：4 Pages

UNSEMI

优恩半导体

丝印：ES1J；Package：DO-214AC；Surface Mount Superfast Recovery Rectifier

文件：476.58 Kbytes 页数：3 Pages

YFWDIODE

佑风微

丝印：ES1J；Package：SMAJ；1A Surface Mount Super Fast Rectifier

文件：1.44675 Mbytes 页数：11 Pages

FUTUREWAFER

丝印：ES1J；Package：SMA；Super-Fast Rectifiers

文件：487.69 Kbytes 页数：4 Pages

BILIN

银河微电

丝印：ES1J；1.0A Surface Mount Super Fast Recovery Rectifier 50V~600V

文件：431.87 Kbytes 页数：2 Pages

PACELEADER

霈峰

丝印：ES1J；Package：SMAF；Surface Mount Superfast Recovery Rectifier

文件：481.29 Kbytes 页数：3 Pages

YFWDIODE

佑风微

丝印：ES1JAF；Package：DO-214AD；Surface Mount Ultrafast Rectifier

Features • Fast Switching Speed – Maximum Trr 35 ns • Ultra Thin Profile − Maximum Height of 1.0 mm • Glass Passivated Junction • UL Flammability 94V−0 Classification • MSL 1 • Green Mold Compound • These Devices are Pb−Free, Halogen Free Free and are RoHS Compliant

文件：235.63 Kbytes 页数：5 Pages

ONSEMI

安森美半导体

丝印：ES1JAF；Package：DO-214AD；Surface Mount Ultrafast Rectifier

Features • Fast Switching Speed – Maximum Trr 35 ns • Ultra Thin Profile − Maximum Height of 1.0 mm • Glass Passivated Junction • UL Flammability 94V−0 Classification • MSL 1 • Green Mold Compound • These Devices are Pb−Free, Halogen Free Free and are RoHS Compliant

文件：274.05 Kbytes 页数：6 Pages

ONSEMI

安森美半导体