Embedded Package-on-Package Memory for Wearables

Kingston’s ePoP provides a highly integrated JEDEC standard component that combines Embedded MultiMedia Card (e•MMC) storage and Low-Power Double Data Rate (LPDDR) DRAM into a Package-on-Package (PoP) solution. ePoP is mounted directly on top of a compatible host System-on-a-Chip (SoC), which r

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KINGSTON

金士顿

BGA

ALTERA

阿尔特

上传：深圳市易芯易电子科技有限公司

BGA

ALTERA/阿尔特拉

上传：深圳市澳亿芯电子科技有限公司