AMD Embedded Ryzen V2000 COM Express® Compact Type 6

Features ƒ AMD Embedded Ryzen 7nm SoC – V2000 APU ƒ COM Express® R3.0 Compact Module Type 6 Pinout ƒ Dual Channel DDR4 SODIMM, max. 64GB (Both ECC & Non-ECC) ƒ High Speed I/Os: 2 USB 3.2 Gen2, 1 PCIe x8 Gen3, 8 PCIe x1 Gen3, and 2 SATA3.0 ƒ Four Display (DP++, HDMI, VGA, LVDS) ƒ Supports iM

文件：4.18813 Mbytes 页数：6 Pages

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Intel® Xeon® D-2700 Processor (Ice Lake-D HCC) COM-HPC® Server Size D

Features ƒ COM-HPC® Server Size D Module ƒ Intel® Xeon® D-2700 processors (Ice Lake-D HCC) ƒ Up to 20 Cores, 30MB LLC Cache, 118W TDP ƒ Quad channel DDR4-3200 RDIMM/LRDIMM up to 512GB (Both ECC & Non-ECC) ƒ 32 x PCIe Gen 4, 17 x PCIe Gen 3, 4 x 25GBASE-KR, IPMB ƒ Supports iManager, Embedded

文件：4.17383 Mbytes 页数：6 Pages

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AMD EPYC™ 7003 Processor COM-HPC® Server Size E module with proprietary pinout

Features ƒ COM-HPC® Server Size E module with proprietary pinout ƒ Up to 64C/225W AMD EYPC™ 7003 real server grade CPU with extreme performance ƒ Up to 512GB large memory size with 4x DDR4 long DIMM ƒ 79 PCIe Gen4 lanes (14 more than COM-HPC STD) ƒ Supports iManager, Embedded Software APIs,

文件：4.17837 Mbytes 页数：6 Pages

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恩XP i.MX8M Cortex®-A53 SMARC 2.0/2.1 Computer-on-Module

Features ƒ 恩XP i.MX 8M processor with dual or quad Arm Cortex A53 cores ƒ 1 x Arm Cortex-M4 core ƒ Onboard 2GB LPDDR4 memory and eMMC 16GB ƒ 1 x HDMI2.0 up to 4096 x 2160, 1 x 4-Lane MIPI DSI ƒ 2 x USB3.0, 4 x USB2.0, 4 x UART, 4 x I2C, 12 x GPIO, 1 x PCIe2.0, 1 x 4-lane MIPI CSI camera inpu

文件：3.11774 Mbytes 页数：4 Pages

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Rockchip RK3399 Cortex®-A72A53 SMARC 2.1 Computer-on-Module

Features ƒ Rockchip RK3399 Arm dual Cortex-A72 and quad Cortex-A53 1.8 GHz ƒ Onboard 2/4GB LPDDR4 memory and 16/32GB eMMC ƒ Support HDMI2.0 4K, 1 x eDP, 1 x LVDS ƒ Support 4K H.264/H.265 Video decoder ƒ 2 x USB3.0, 3 x USB2.0,1 x USB2,0 OTG, 3 x UART, 12 x GPIO ƒ 1 x PCIe2.0, 1 x SATA, 2 x M

文件：3.67105 Mbytes 页数：5 Pages

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恩XP i.MX8M Mini Cortex®-A53 SMARC 2.0/2.1 Computer-on-Module

Features ƒ 恩XP i.MX 8M Mini processor with up to 4 Arm Cortex A53 cores ƒ 1 x Arm Cortex-M4 cores ƒ Onboard LPDDR4 memory and eMMC ƒ 1 x 4 lane MIPI-CSI,1 x Dual channel LVDS or 1 x Display Port ƒ 4 x USB2.0, 1 x USB 2.0 OTG, 4 x UART, 4 x I2C, 12 x GPIO, 1 x PCIe2.0, 1x Gigabit LAN ƒ Suppo

文件：3.06833 Mbytes 页数：4 Pages

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恩XP i.MX8M Plus Cortex®-A53 2.5 SBC with UIO40-Express

Features ƒ 恩XP Arm® Cortex®-A53 i.MX8M Plus Quad/Dual up to 1.8 GHz ƒ Onboard LPDDR4 4 GB/ 6 GB, 4000MT/s memory ƒ HDMI 1920x1080 at 60Hz, 1 Single or 1 Dual Channel 24 bit LVDS (or 1 4-Lane MIPI-DSI by BOM Option) ƒ 1 4-wire RS-232/422/485, 1 USB3.2 Gen1 By 1, 1 USB2.0, 1 Micro SD, 1 Mic. i

文件：3.95121 Mbytes 页数：6 Pages

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恩XP i.MX6 Cortex-A9 RISC Embedded Mini-ITX Box Computer

Features ƒ 恩XP ARM Cortex-A9 i.MX6 Dual/Quad 1GHz high performance processor ƒ On board DDR3 1066MHz 1GB/2GB memory and 8GB EMMC NAND flash ƒ Supports Dual Display: VGA/HDMI ƒ Supports 1 x mini-PCIe, 4 x serial ports, 6 x USB, 1 x M.2 socket,8 x GPIO, 1 x CAN ƒ Low power consumption, fanless

文件：3.18839 Mbytes 页数：4 Pages

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Intel Atom E3900 series Embedded SBC Fanless Slim System

Features ƒ Intel® Atom™ E3900 series ƒ Onboard 4GB LPDDR4-2400MT/s, 32GB eMMC ƒ Independent display by HDMI ƒ Semi-Industry Fanless slim systen, Din Rail or Wall mount design ƒ Support HDMI x 1 , GbE x 2 USB 3.0 x 2, COM x 2, DIO x 2 ƒ Flexible expansion M.2 E key, F/S miniPCIe ƒ 12V power

文件：1.81659 Mbytes 页数：6 Pages

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9th/8th Gen. Intel Xeon /Core™ Processor, 3.5 SBC w/ MIOe

Features ƒ 9th/8th Gen. Intel® Xeon®/Core™ Processor, up to 6 cores, and TDP 45W/25W ƒ Dual channel DDR4-2400, up to 64GB*, ECC for Xeon SKU ƒ Triple simultaneous displays with 48-bit LVDS+HDMI+DP ƒ USB 3.1 Gen2 (10 Gbps), TPM 2.0 & NVMe/PCIe Gen3x4 SSD ƒ Dual GbE, SATAIII, RS-232/422/485, CA

文件：1.8667 Mbytes 页数：6 Pages

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