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EP3C25集成电路(IC)的FPGA(现场可编程门阵列)规格书PDF中文资料

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厂商型号

EP3C25

参数属性

EP3C25 封装/外壳为144-LQFP 裸露焊盘;包装为托盘;类别为集成电路(IC)的FPGA(现场可编程门阵列);产品描述:IC FPGA 82 I/O 144EQFP

功能描述

Cyclone Series Device Thermal Resistance

封装外壳

144-LQFP 裸露焊盘

文件大小

157.18 Kbytes

页面数量

7

生产厂商

Altera

中文名称

阿尔特

网址

网址

数据手册

下载地址一下载地址二到原厂下载

更新时间

2025-12-22 23:01:00

人工找货

EP3C25价格和库存,欢迎联系客服免费人工找货

EP3C25规格书详情

Cyclone III Device Family Overview

Cyclone® III device family offers a unique combination of high functionality, low power and low cost. Based on Taiwan Semiconductor Manufacturing Company (TSMC) low-power (LP) process technology, silicon optimizations and software features to minimize power consumption, Cyclone III device family provides the ideal solution for your high-volume, low-power, and cost-sensitive applications. To address the unique design needs, Cyclone III device family offers the following two variants:

■ Cyclone III—lowest power, high functionality with the lowest cost

■ Cyclone III LS—lowest power FPGAs with security

With densities ranging from about 5,000 to 200,000 logic elements (LEs) and 0.5 Megabits (Mb) to 8 Mb of memory for less than ¼ watt of static power consumption, Cyclone III device family makes it easier for you to meet your power budget. Cyclone III LS devices are the first to implement a suite of security features at the silicon, software, and intellectual property (IP) level on a low-power and high-functionality FPGA platform. This suite of security features protects the IP from tampering, reverse engineering and cloning. In addition, Cyclone III LS devices support design separation which enables you to introduce redundancy in a single chip to reduce size, weight, and power of your application.

This chapter contains the following sections:

■ “Cyclone III Device Family Features” on page 1–1

■ “Cyclone III Device Family Architecture” on page 1–6

■ “Reference and Ordering Information” on page 1–12

产品属性

  • 产品编号:

    EP3C25E144C7

  • 制造商:

    Intel

  • 类别:

    集成电路(IC) > FPGA(现场可编程门阵列)

  • 系列:

    Cyclone® III

  • 包装:

    托盘

  • 电压 - 供电:

    1.15V ~ 1.25V

  • 安装类型:

    表面贴装型

  • 工作温度:

    0°C ~ 85°C(TJ)

  • 封装/外壳:

    144-LQFP 裸露焊盘

  • 供应商器件封装:

    144-EQFP(20x20)

  • 描述:

    IC FPGA 82 I/O 144EQFP

供应商 型号 品牌 批号 封装 库存 备注 价格
ALTERA/阿尔特拉
24+
NA/
3306
原装现货,当天可交货,原型号开票
询价
ALTERA/阿尔特拉
24+
TQFP144
100
大批量供应优势库存热卖
询价
ALTERA/阿尔特拉
25+
BGA-324
58788
百分百原装现货 实单必成 欢迎询价
询价
正纳电子热销
23+
NA
26094
原装正品 可支持验货,欢迎咨询
询价
INTEL
23+
SMD
880000
明嘉莱只做原装正品现货
询价
ALTERA
18+
BGA
26384
全新原装现货,可出样品,可开增值税发票
询价
ALTERA
24+
BGA240
4000
刚到全新原装现货特价热卖
询价
ALTERA
NEW
QFP
18689
代理全系列销售,全新原装正品,价格优势,长期供应,量大可订
询价
ALTERA/阿尔特拉
22+
256-UBGA(14x14)
5500
阿尔特拉国外优势渠道,支持终端生产
询价
ALTERA
23+
BGAQFP
8659
原装公司现货!原装正品价格优势.
询价