EMS-TGL-I3S中文资料BCM数据手册PDF规格书

特性 Features

• 11th Gen. 10nm Intel® Core™ i7/i5/i3 Tiger Lake UP3 BGA onboard • Intel® Iris Xe Graphic (Gen 12), up to 96 Execution Units (EU) • Supports IET expansion modules – Intelligent Expansion Technology

(IET) provides high expandability and flexibility for developing or

integrating with application-specific I/O requirements • 2 x SODIMM sockets support up to 64GB DDR4 3200MT/s • 2.5G Base-Tx GbE LAN - Intel® I225-LM Gigabit Ethernet Controllers • M.2 supports 5G (Sub-6G) module, NVMe SSD • 8 x Antenna Holes • Supports 4K Dual Display: DP++, HDMI 2.0b 4096x2304 max • Supports Wide Temperature (-40°C ~ 70°C) • Supports Wide Range DC (+9 ~ +32 V) • Fanless, Rugged, metal chassis with IP-50 rating • Anti-shock (5G) and Anti-vibration (55G) • Wall Mount, optional Din-Rail Mount • Supports HW TPM 2.0