ELJRF3N3MFB

High Frequency Use (Non Magnetic Core) RF, RE, ND, NC, NA RoHS compliant

HighFrequencyUse(NonMagneticCore)RF,RE,ND,NC,NA ■Features ●Highfrequencycapabilityduetoitsnonmagneticcore. ●CapableofbeingRe-floworflowsoldered. ●Wideline-upfrom1005to3225casesizes. ●Goodformounting. ●RoHScompliant ■RecommendedAp

ELJRF3N3ZFB

HighFrequencyUse(NonMagneticCore)RF,RE,ND,NC,NARoHScompliant

HighFrequencyUse(NonMagneticCore)RF,RE,ND,NC,NA ■Features ●Highfrequencycapabilityduetoitsnonmagneticcore. ●CapableofbeingRe-floworflowsoldered. ●Wideline-upfrom1005to3225casesizes. ●Goodformounting. ●RoHScompliant ■RecommendedAp

ELJRG3N3DF

NonMagneticCoreTypesRG,RF,RE,NJ,ND,NC,NADimensionsinmm(nottoscale)

F3N3

SiliconPowerRectifiers

EdalSeriesFpowerrectifiersarestudmountedDO-5packages.Becausethesiliconjunctioniscarefullyfittedwithinaglass-to-metalhermeticallysealedcase,reliableoperationisassured,evenwithextremehumidityandunderothersevereenvironmentalconditions.TheseriesFpowerrectifiers

MTNK3N3

ESDprotectedN-CHANNELMOSFET

NIN-HD3N3_TRF

WirewoundChipInductors

NIN-HD3N3JTRF

SIZESK(0402),J(0603),D(0805)ANDC(1008)

NIN-HD3N3JTRF

WirewoundChipInductors

FEATURES •SIZESK(0402),J(0603),D(0805)ANDC(1008) •HIGHQ,HIGHCURRENTANDHIGHSRFCHARACTERISTICS •BOTHFLOWANDREFLOWSOLDERINGAPPLICABLE* •HIGHINDUCTANCEAVAILABLEINSMALLSIZE •EMBOSSEDPLASTICTAPEPACKAGEFORAUTOMATICPICK-PLACE

NIN-HK3N3STRF

WirewoundChipInductors

FEATURES •SIZESK(0402),J(0603),D(0805)ANDC(1008) •HIGHQ,HIGHCURRENTANDHIGHSRFCHARACTERISTICS •BOTHFLOWANDREFLOWSOLDERINGAPPLICABLE* •HIGHINDUCTANCEAVAILABLEINSMALLSIZE •EMBOSSEDPLASTICTAPEPACKAGEFORAUTOMATICPICK-PLACE

NIN-HK3N3STRF

WirewoundChipInductors