ELJPA3R3MF中文资料松下数据手册PDF规格书

HIGH POWER

ELJ-PB Series 1812 Case Size

Features:

• Low DCR and large current capability, suitable for power circuitry

• Wire wound, resin molded chip inductor. (PC, PA, PB types)

• Capable of being Re-flow or flow soldered

• Wide line-up from 1005 to 4532 case sizes

• Good for mounting

Applications:

• AV equipment, Wireless communication equipment and various types of general electronic equipment

GENERAL USE

ELJ-FC Series 1008 Case Size

Features:

• General use wire wound, resin molded chip inducto

• Capable of being Re-fl ow or fl ow soldered

• Wide line-up from 2520 to 4532 case sizes

• Good for mounting

Applications:

• AV equipment, Wireless communication equipment and various types of general electronic equipment