EGN010MK

High Voltage - High Power GaN-HEMT

EMI-EU010

PreparedinaccordancewithRegulation

EPC-BRKP-RM010

2Usystemwith8th/9thGenIntel®Core™iCPU(LGA1151)

Features ƒSupportsIntel®8th/9thGenCore™iprocessor(LGA1151)withIntelC246/ H310chipset ƒUpto4xExtensionCardbyRiserCard ƒ3xGigaLANand8xUSB3.0 ƒ2xRS-232/422/485and4xRS232serialports,16bitGPIO ƒ4xSATA,1xM.2Ekey,1xM.2B/Mkey,2xF/SmSATA ƒVG

EPC-BRKT-VM010

THINbarebonewith8th/9thGen.Intel®DesktopCoreiProcessor

Features ƒTHINCompactdesignwith44.2mminheight ƒThinbarebonewithmulti-IOportsissuitableforvarietyofapplication environmentswithDC-indesign ƒEasy/quickinstallationforadditionalperipherals ƒSupportWall/VESA/DinRailKit ƒLocktypeDCpowerjack

EPC-BRKU-DM010

Intel8thGenUSeriesPalm-sizedFanlessSystem

Features ƒEquippowerful8th-GenIntel®Core™iprocessor ƒPalm-sizedchassisdesign(180x116.7x66mm) ƒDiversesystemI/O:4xCOM,4xUSB,2xHDMI,2xGbELAN,16-bitGPIO ƒ3xM.2expansionslots(1x2230E-key,1x2242/3042B-Key,1x2280 M-key)foredgeAIcapability ƒWin1

EPC-BRKU-DR010

IntelAtomPlatformPalmSizeFanlesssystem

Features ƒIntel®AtomQuadCore/DualCoreProcessor ƒPalm-sizeformfactor:170(L)x117(W)x52.6mm(H) ƒSupports2xLAN,2xCOMport,1xHDMI,1xDisplayPort,4xUSB3.0, CANBus,andDCIN12~24V ƒBuilt-in1xM.2expansionslot(PCIeGen2,USB2.0co-lay),1xFullsize MiniPC

EPC-BRKU-DR010

IntelAtomPlatformPalmSizeFanlesssystem

Features ƒIntel®ApolloLakeE3900seriesProcessor ƒPalm-sizeformfactor:170X117X52.6mm ƒSupports3xLAN,4xCOMport,1xHDMI,1xDisplayPort,4xUSB3.0, CANBus,16bitGPIO,Audioin/outandDCIN12~24V ƒBuilt-in1xM.2expansionslot(PCIeGen2,USB2.0co-lay),1xFull

EPC-BRKU-VM010

Intel8thGenUSeriesPalm-sizedFanlessSystem

Features ƒEquippowerful8th-GenIntel®Core™iprocessor ƒPalm-sizedchassisdesign(180x116.7x66mm) ƒDiversesystemI/O:4xCOM,4xUSB,2xHDMI,2xGbELAN,16-bitGPIO ƒ3xM.2expansionslots(1x2230E-key,1x2242/3042B-Key,1x2280 M-key)foredgeAIcapability ƒWin1

EVS010

10Øx38mm

EW010

1/8WATTMETAL