EFOB中文资料松下数据手册PDF规格书

■ Features

● Encased in a ceramic package

● High reliability against soldering heat and mechanical stress

● Moisture-proof sealing

● 1.2 mm maximum (SS/SM/BM/JM),

● Designed for reflow soldering

● Flat-bottom plate for better mountings

● Simplifies oscillation circuits by reducing the number of circuit parts

● RoHS compliant

■ Recommended Applications

● Clock generator for microprocessors

● Carrier circuit between telecommunication equipment

(Telephone to telephone, personal computer to printer)

■ Handling Precautions (See Page 175 to 176)

■ Packaging Specifications

See Page 169 to 177