6th Gen Intel® Core™ SoC Processor i7/i5/i3 3.5”Micro Module

Features • Onboard 6th Gen Intel® Core™ i7/i5/i3 BGA Processor • 1 x 260-pin DDR4 SODIMM Socket supports up to 16GB DDR4 2133 SDRAM (non-ECC) • Supports Triple Display, Dual-channel 18/24-bit LVDS, 2 x HDMI • 1 x SATA III, 1 x mini-PCIe, 1 x M.2 , 4 x USB 3.0 (compatible with USB 2.0), 2 x USB

文件：360 Kbytes 页数：1 Pages

BCM

6th Gen Intel® Core™ SoC Processor i7/i5/i3 3.5”Micro Module

Features • Onboard 6th Gen Intel® Core™ i7/i5/i3 BGA Processor • 1 x 260-pin DDR4 SODIMM Socket supports up to 16GB DDR4 2133 SDRAM (non-ECC) • Supports Triple Display, Dual-channel 18/24-bit LVDS, 2 x HDMI • 1 x SATA III, 1 x mini-PCIe, 1 x M.2 , 4 x USB 3.0 (compatible with USB 2.0), 2 x USB

文件：360 Kbytes 页数：1 Pages

BCM

BGA

TOSHIBA/东芝

上传：深圳庞田科技有限公司

DIP26

HITACHI/日立

上传：深圳市明盛嘉电子科技有限公司

NA

Panasonic

松下

上传：深圳权泰科技有限公司