6th Gen Intel®Core ™ Processor i7/i5/i3 3.5”Micro Module with Intel® QM170 Chipset

Features • Onboard 6th Gen Intel® Core™ i7/i5/i3 BGA Processor • 1 x 260-pin DDR4 SODIMM Socket supports up to 16GB DDR4 2133 SDRAM (non-ECC) • Dual-channel 18/24-bit LVDS, HDMI, VGA • Triple Display (LVDS, 2 x HDMI) • 2 x SATA III, 1 x mini-PCIe, 4 x USB 3.0, 1 x M.2 (2242) B-Key, 2 x USB 2.0,

文件：344.45 Kbytes 页数：1 Pages

BCM

6th Gen Intel®Core ™ Processor i7/i5/i3 3.5”Micro Module with Intel® QM170 Chipset

Features • Onboard 6th Gen Intel® Core™ i7/i5/i3 BGA Processor • 1 x 260-pin DDR4 SODIMM Socket supports up to 16GB DDR4 2133 SDRAM (non-ECC) • Dual-channel 18/24-bit LVDS, HDMI, VGA • Triple Display (LVDS, 2 x HDMI) • 2 x SATA III, 1 x mini-PCIe, 4 x USB 3.0, 1 x M.2 (2242) B-Key, 2 x USB 2.0,

文件：344.45 Kbytes 页数：1 Pages

BCM

BGA

TOSHIBA/东芝

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DIP26

HITACHI/日立

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NA

Panasonic

松下

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