7th Gen Intel® Core ™ Processor i7/i5/i3 3.5”Micro Module with Intel® QM175 Chipset

Features • Onboard 7th Gen Intel® Core™ i7/i5/i3 BGA Processor • 1 x 260-pin DDR4 SODIMM Socket supports up to 16GB DDR4 2400 SDRAM (Non-ECC) • Dual-channel 18/24-bit LVDS, HDMI • Supports Triple Display (LVDS, 2 x HDMI) • 2 x SATA III, 1 x mini-PCIe, 4 x USB 3.0, 1 x M.2 (2242) B-Key, 2 x USB

文件：382.7 Kbytes 页数：1 Pages

BCM

7th Gen Intel® Kaby Lake-U Processor 3.5” Micro Module

Features • Top Layer Soldered Processor • Single DRAM Socket, Max. Up to 16GB DDR4 2133MT/s • Triple Display (Dual HDMI, Dual-Ch 18/24-bit LVDS) • Dual Expansion Slot, M.2 Key-B, Full Size mCPIe • Dual Gigabit Ethernet, HD Audio Code • TPM 2.0

文件：415.97 Kbytes 页数：1 Pages

BCM

10GBASE-LX4 XENPAK Module

文件：1.90607 Mbytes 页数：1 Pages

EMCORE

Emcore Corporation

Compact Analog Addressable Fire Alarm Control Panel

文件：243.04 Kbytes 页数：3 Pages

HONEYWELL

霍尼韦尔