GLASS PASSIVATED SUPER FAST RECOVERY BRIDGE RECTIFIERS

文件：331.85 Kbytes 页数：2 Pages

CHENDA

辰达半导体

丝印：EABM；Package：SOIC；BiCMOS LOW-POWER CURRENT-MODE PWM CONTROLLERS

FEATURES · Controlled Baseline – One Assembly/Test Site, One Fabrication Site – Extended Temperature Performance of –55°C to 125°C · Enhanced Diminishing Manufacturing Sources (DMS) Support · Enhanced Product-Change Notification · Qualification Pedigree (1) · Enhanced Replacements for UC

文件：522.99 Kbytes 页数：24 Pages

TI

德州仪器

丝印：EABM；Package：SOIC；BiCMOS LOW-POWER CURRENT-MODE PWM CONTROLLERS

FEATURES · Controlled Baseline – One Assembly/Test Site, One Fabrication Site – Extended Temperature Performance of –55°C to 125°C · Enhanced Diminishing Manufacturing Sources (DMS) Support · Enhanced Product-Change Notification · Qualification Pedigree (1) · Enhanced Replacements for UC

文件：522.99 Kbytes 页数：24 Pages

TI

德州仪器

丝印：EABM；Package：SOIC；BiCMOS LOW-POWER CURRENT-MODE PWM CONTROLLERS

FEATURES · Controlled Baseline – One Assembly/Test Site, One Fabrication Site – Extended Temperature Performance of –55°C to 125°C · Enhanced Diminishing Manufacturing Sources (DMS) Support · Enhanced Product-Change Notification · Qualification Pedigree (1) · Enhanced Replacements for UC

文件：522.99 Kbytes 页数：24 Pages

TI

德州仪器

丝印：EABM；Package：SOIC；BiCMOS LOW-POWER CURRENT-MODE PWM CONTROLLERS

FEATURES · Controlled Baseline – One Assembly/Test Site, One Fabrication Site – Extended Temperature Performance of –55°C to 125°C · Enhanced Diminishing Manufacturing Sources (DMS) Support · Enhanced Product-Change Notification · Qualification Pedigree (1) · Enhanced Replacements for UC

文件：522.99 Kbytes 页数：24 Pages

TI

德州仪器

XM3 Half-Bridge Power Module Family

High Temperature (175 °C) OperationLow Inductance (6.7 nH) DesignUtilizes Latest 3rd Generation Silicon Carbide MOSFETSIntegrated Temperature Sensor and Kelvin-Drain ConnectionSilicon Nitride Ceramic Substrate and Copper Baseplate • High Temperature (175 °C) Operation\n• Low Inductance (6.7 nH) Design\n• Utilizes Latest 3rd Generation Silicon Carbide MOSFETS\n• Integrated Temperature Sensor and Kelvin-Drain Connection\n• Silicon Nitride Ceramic Substrate and Copper Baseplate;

Wolfspeed(CREE)

快速整流桥 Fast/Ultra/Super Fast Bridge Rectifiers

Seno

深迪半导体

快速整流桥 Fast/Ultra/Super Fast Bridge Rectifiers

Seno

深迪半导体

Package：4-SMD，鸥翼；包装：托盘 类别：分立半导体产品 二极管 - 桥式整流器 描述：BRIDGE RECT 1PHASE 200V 1A ABS

TSC

台湾半导体

Package：4-SMD，鸥翼；包装：散装 类别：分立半导体产品 二极管 - 桥式整流器 描述：BRIDGE RECT 1PHASE 200V 1A ABS

TSC

台湾半导体