E2FF中文资料RFE数据手册PDF规格书
相关芯片规格书
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E2FF规格书详情
特性 Features
Low profile package
Ideal for automated placement
Glass passivated chip junction
High forward surge capability
Super Fast reverse recovery time
Meets MSL level 1, per J-STD-020, LF maximum peak
of 260 °C
