Expansion Unit DX517

Highlights • Online volume expansion • Dedicated local backup solution • Hot-swappable drive tray design • Synchronized system operation with DiskStation

文件：795.73 Kbytes 页数：3 Pages

SYNOLOGY

群晖科技

1550nm 铟镓砷 Hybrid 3D stack Lidar芯片

DX517是一款专门为人眼安全打造的堆叠封装远距离探测Lidar芯片。其SPAD采用基于大芯半导体核心知识产权专利的铟镓砷材料，可以在1550nm波段实现高探测效率。该芯片将铟镓砷材料工艺的感光wafer和传统硅工艺的Logic wafer进行混合型堆叠封装。该芯片可以使用在自动驾驶汽车、无人机等各种远距离应用。 • 1550nm InGaAs SPAD \n• Hybrid 3D Stack \n• 300m long distance detection \n• 3D Lidar technology with high sensitivity SPAD detection \n• Delivers high SNR, wide dynamic range and no multi-path reflections \n• 10um x 10 um BSI pixels \n• 200 x600 SPAD Detection And Ranging pixels ;

DAXINSH

上海大芯

GENERAL PURPOSE SILICON RECTIFIER

FEATURES ♦ The plastic package carries Underwriters Laboratory Flammability Classification 94V-0 ♦ Construction utilizes void-free molded plastic technique ♦ Low reverse leakage ♦ High forward surge current capability ♦ High temperature soldering guaranteed: 250 °C/10 seconds,0.375”(9.5mm) le

文件：337.09 Kbytes 页数：2 Pages

OLITECH

奥力特

U.L. Approved Dual Function Fuse Resistors

文件：209.32 Kbytes 页数：2 Pages

IRCTT

Dual Function Fuse Resistors

文件：347.47 Kbytes 页数：2 Pages

TTELEC