丝印：90LV027M；Package：SOIC；DS90LV027 LVDS Dual High Speed Differential Driver

1FEATURES 23• Ultra Low Power Dissipation • Operating Range above 155 Mbps • Flow-through pinout simplifies PCB layout • Conforms to TIA/EIA-644 Standard • 8-Lead SOIC Package Saves Space • VCM ±1V center around 1.2V • Low Differential Output Swing Typical 340 mV • Power Off Protection (ou

文件：415.19 Kbytes 页数：14 Pages

TI

德州仪器

LVDS Dual High Speed Differential Driver

文件：708.86 Kbytes 页数：10 Pages

TI

德州仪器

DS90LV027 LVDS Dual High Speed Differential Driver

1FEATURES 23• Ultra Low Power Dissipation • Operating Range above 155 Mbps • Flow-through pinout simplifies PCB layout • Conforms to TIA/EIA-644 Standard • 8-Lead SOIC Package Saves Space • VCM ±1V center around 1.2V • Low Differential Output Swing Typical 340 mV • Power Off Protection (ou

文件：415.19 Kbytes 页数：14 Pages

TI

德州仪器

DS90LV027 LVDS Dual High Speed Differential Driver

1FEATURES 23• Ultra Low Power Dissipation • Operating Range above 155 Mbps • Flow-through pinout simplifies PCB layout • Conforms to TIA/EIA-644 Standard • 8-Lead SOIC Package Saves Space • VCM ±1V center around 1.2V • Low Differential Output Swing Typical 340 mV • Power Off Protection (ou

文件：415.19 Kbytes 页数：14 Pages

TI

德州仪器