丝印：DS90C031E-QMLQ；Package：LCCC；DS90C031QML LVDS Quad CMOS Differential Line Driver

1FEATURES 2• Radiation guaranteed 100 krad(Si) • High impedance LVDS outputs with power-off • ±350 mV differential signaling • Low power dissipation • Low differential skew • Low propagation delay • Pin compatible with DS26C31 • Compatible with IEEE 1596.3 SCI LVDS standard • Compatible

文件：804.88 Kbytes 页数：24 Pages

TI

德州仪器

丝印：DS90C031WQMLVQ；Package：CFP；DS90C031QML LVDS Quad CMOS Differential Line Driver

1FEATURES 2• Radiation guaranteed 100 krad(Si) • High impedance LVDS outputs with power-off • ±350 mV differential signaling • Low power dissipation • Low differential skew • Low propagation delay • Pin compatible with DS26C31 • Compatible with IEEE 1596.3 SCI LVDS standard • Compatible

文件：804.88 Kbytes 页数：24 Pages

TI

德州仪器

丝印：DS90C032E-QMLQ；Package：LCCC；DS90C032QML LVDS Quad CMOS Differential Line Receiver

1FEATURES 2• Single Event Latchup (SEL) Immune 120 MeVcm2/ mg • High Impedance LVDS Inputs with Power-Off. • Accepts Small Swing (330 mV) Differential Signal Levels • Low Power Dissipation • Low Differential Skew • Low Chip to Chip Skew • Pin Compatible with DS26C32A • Compatible with IE

文件：869.18 Kbytes 页数：22 Pages

TI

德州仪器

丝印：DS90C032WQMLVQ；Package：CFP；DS90C032QML LVDS Quad CMOS Differential Line Receiver

1FEATURES 2• Single Event Latchup (SEL) Immune 120 MeVcm2/ mg • High Impedance LVDS Inputs with Power-Off. • Accepts Small Swing (330 mV) Differential Signal Levels • Low Power Dissipation • Low Differential Skew • Low Chip to Chip Skew • Pin Compatible with DS26C32A • Compatible with IE

文件：869.18 Kbytes 页数：22 Pages

TI

德州仪器

丝印：DS90C032WLQMLVQ；Package：CFP；DS90C032QML LVDS Quad CMOS Differential Line Receiver

1FEATURES 2• Single Event Latchup (SEL) Immune 120 MeVcm2/ mg • High Impedance LVDS Inputs with Power-Off. • Accepts Small Swing (330 mV) Differential Signal Levels • Low Power Dissipation • Low Differential Skew • Low Chip to Chip Skew • Pin Compatible with DS26C32A • Compatible with IE

文件：869.18 Kbytes 页数：22 Pages

TI

德州仪器

丝印：DS90C032WGLQMLVQ；Package：CFP；DS90C032QML LVDS Quad CMOS Differential Line Receiver

1FEATURES 2• Single Event Latchup (SEL) Immune 120 MeVcm2/ mg • High Impedance LVDS Inputs with Power-Off. • Accepts Small Swing (330 mV) Differential Signal Levels • Low Power Dissipation • Low Differential Skew • Low Chip to Chip Skew • Pin Compatible with DS26C32A • Compatible with IE

文件：869.18 Kbytes 页数：22 Pages

TI

德州仪器

丝印：DS90C031WRQMLVQ；Package：CFP；DS90C031QML LVDS Quad CMOS Differential Line Driver

1FEATURES 2• Radiation guaranteed 100 krad(Si) • High impedance LVDS outputs with power-off • ±350 mV differential signaling • Low power dissipation • Low differential skew • Low propagation delay • Pin compatible with DS26C31 • Compatible with IEEE 1596.3 SCI LVDS standard • Compatible

文件：804.88 Kbytes 页数：24 Pages

TI

德州仪器

丝印：DS90C031WGRQMLVQ；Package：CFP；DS90C031QML LVDS Quad CMOS Differential Line Driver

1FEATURES 2• Radiation guaranteed 100 krad(Si) • High impedance LVDS outputs with power-off • ±350 mV differential signaling • Low power dissipation • Low differential skew • Low propagation delay • Pin compatible with DS26C31 • Compatible with IEEE 1596.3 SCI LVDS standard • Compatible

文件：804.88 Kbytes 页数：24 Pages

TI

德州仪器

PowerCap，带有晶振

The DS9034PCX PowerCap is designed to be a lithium power source for nonvolatile timekeeping RAMs in Dallas Semiconductor's directly surface-mountable PowerCap Module (PCM) package. After a PowerCap module board has been soldered in place and cleaned, the DS9034PCX PowerCap is placed on top of the PC \n• Provides 10 Years of Battery Backup Power for Nonvolatile Timekeeping RAMs in the PowerCap Module Package (PCM) \n• Snaps Directly Onto Surface-Mounted PowerCap Module Boards \n• Detachment Feature Allows Easy Removal \n• Compatible with these 34-Pin PowerCap Module Boards:\n• DS1386P \n• DS1486;

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PowerCap

DS9034PC PowerCap是一款为非易失(NV) SRAM提供的锂电池电源帽，基于Dallas Semiconductor直接表面贴装PowerCap模块封装。PowerCap模块焊接、清理后，DS9034PC PowerCap可以直接固定在基座上，构成完整的NV SRAM模块。PowerCap从形状上可以避免不正确的安装，通过设计即使在剧烈冲击与振动的情况下仍能保持与主模块基座的机械和电气接触。DS9034PC可以轻松地进行拆卸，只需将普通的螺丝刀插入其可分离部位、轻轻向上向外撬，就可以将PowerCap从模块基座上卸下来。 • 为PowerCap模块(PCM)封装的NV SRAM提供10年备用电池电源\n• 直接固定在表面贴装PowerCap模块基座上，构成完整的NV SRAM模块\n• 模块基座焊接后安装，使锂电池免受回流焊的高温\n• 即使在剧烈冲击与振动情况下仍能保持与模块基座的机械与电气连接\n• 可分离特性，使用普通螺丝刀就可以方便的拆卸\n• 定期更换可以无限延长NV SRAM模块的寿命\n• 与以下PowerCap模块基座兼容：\n• DS1230YP/ABP/WP \n• DS1245YP/ABP/WP \n• DS1250YP/ABP/WP \n• DS1330YP/ABP/WP \n• DS1;

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亚德诺