DS310W中文资料淄博圣诺电子数据手册PDF规格书
DS310W规格书详情
Features
● Schottky Barrier Chip
● Ideally Suited for Automatic Assembly
● Low Power Loss, High Efficiency
● Surge Overload Rating to 2 0A Peak
● For Use in Low Voltage Application
● Guard Ring Die Construction
● Plastic Case Material has UL Flammability
Classification Rating 94V-O
Mechanical Data
● Weight: 0.01 grams (approx.)
● Case: SOD-123, Molded Plastic
● Terminals: Solder Plated, Solderable per MIL-STD-750, Method 2026
● Polarity: Cathode Band or Cathode Notch
● Marking: Type Number
● Lead Free: For RoHS / Lead Free Version
| 供应商 | 型号 | 品牌 | 批号 | 封装 | 库存 | 备注 | 价格 |
|---|---|---|---|---|---|---|---|
JINGDAO/晶导微 |
24+ |
NA/ |
3260 |
原装现货,当天可交货,原型号开票 |
询价 | ||
JD晶导微 |
25+ |
SOD-123FL |
30000 |
原装正品,假一罚十! |
询价 | ||
DALLAS |
24+ |
BGA |
6980 |
原装现货,可开13%税票 |
询价 | ||
DALLAS |
24+/25+ |
95 |
原装正品现货库存价优 |
询价 | |||
DALLAS |
2138+ |
BGA |
8960 |
专营BGA,QFP原装现货,假一赔十 |
询价 | ||
DALLAS |
2016+ |
BGA |
4558 |
只做进口原装现货!假一赔十! |
询价 | ||
JINGDAO/晶导微 |
21+ |
SOD-123FL |
30000 |
晶导优势分销 实单必成 可开13点增值税 |
询价 | ||
MAXIM |
23+ |
BGA |
8888 |
专做原装正品,假一罚百! |
询价 | ||
DALLAS |
22+ |
BGA |
8000 |
原装正品支持实单 |
询价 | ||
DALLAS |
24+ |
BGA |
9 |
询价 |
