DRA829JMTGCALFR中文资料德州仪器数据手册PDF规格书

1 Features

Processor cores:

• Dual 64-bit Arm® Cortex®-A72 microprocessor

subsystem at up to 2.0GHz

– 1MB shared L2 cache per dual-core Arm®

Cortex®-A72 cluster

– 32KB L1 DCache and 48KB L1 ICache per

Cortex®-A72 Core

• Six Arm® Cortex®-R5F MCUs at up to 1.0GHz

– 16K I-Cache, 16K D-Cache, 64K L2 TCM

– Two Arm® Cortex®-R5F MCUs in isolated MCU

subsystem

– Four Arm® Cortex®-R5F MCUs in general

compute partition

• Deep-learning Matrix Multiply Accelerator (MMA),

up to 8 TOPS (8b) at 1.0 GHz

• C7x floating point, vector DSP, up to 1.0 GHz,

80 GFLOPS, 256 GOPS

• Two C66x floating point DSP, up to 1.35 GHz,

40 GFLOPS, 160 GOPS

• 3D GPU PowerVR® Rogue 8XE GE8430, up to

750 MHz, 96 GFLOPS, 6 Gpix/sec

Memory subsystem:

• Up to 8MB of on-chip L3 RAM with ECC and

coherency

– ECC error protection

– Shared coherent cache

– Supports internal DMA engine

• External Memory Interface (EMIF) module with

ECC

– Supports LPDDR4 memory types

– Supports speeds up to 4266 MT/s

– 32-bit data bus with inline ECC up to 14.9GB/s

• General-Purpose Memory Controller (GPMC)

• 512KB on-chip SRAM in MAIN domain, protected

by ECC

Display subsystem:

• One eDP/DP interface with Multi-Display Support

(MST)

– HDCP1.4/HDCP2.2 high-bandwidth digital

content protection

• One DSI TX (up to 2.5K)

• Up to two DPI

Video acceleration:

• Ultra-HD video, one (3840 × 2160p, 60 fps), or two

(3840 × 2160p, 30 fps) H.264/H.265 decode

• Full-HD video, four (1920 × 1080p, 60 fps), or eight

(1920 × 1080p, 30 fps) H.264/H.265 decode

• Full-HD video, one (1920 × 1080p, 60 fps), or up to

three (1920 × 1080p, 30 fps) H.264 encode

Functional Safety:

• Functional Safety-Compliant targeted (on select

part numbers)

– Developed for functional safety applications

– Documentation available to aid ISO 26262/IEC

61508 functional safety system design up to

ASIL-D/SIL-3 targeted

– Systematic capability up to ASIL-D/SC-3

targeted

– Hardware integrity up to ASIL-D/SIL-3 targeted

for MCU Domain

– Hardware integrity up to ASIL-B/SIL-2 targeted

for Main Domain

– Safety-related certification

• ISO 26262 certification up to ASIL-D by TÜV

SÜD planned

• IEC 61508 certification up to SIL-3 by TÜV

SÜD planned

• AEC-Q100 qualified on part number variants

ending in Q1

• Device security (on select part numbers):

• Secure boot with secure run-time support

• Customer programmable root key, up to RSA-4K

or ECC-512

• Embedded hardware security module

• Crypto hardware accelerators – PKA with ECC,

AES, SHA, RNG, DES and 3DES

High speed serial interfaces:

• Two CSI2.0 4L RX plus one CSI2.0 4L TX

• Integrated Ethernet switch supporting up to 8

external ports

– All ports support 2.5Gb SGMII

– All ports support 1Gb SGMII/RGMII

– All ports support 100Mb RMII

– Any two ports support QSGMII (using 4 internal

ports per QSGMII)

• Up to four PCI-Express® (PCIe) Gen3 controllers

– Gen1 (2.5GT/s), Gen2 (5.0GT/s), and Gen3

(8.0GT/s) operation with auto-negotiation

– Up to two lanes per controller

• Two USB 3.0 dual-role device (DRD) subsystem

– Two enhanced SuperSpeed Gen1 ports

– Each port supports Type-C switching

– Each port independently configurable as USB

host, USB peripheral, or USB DRD

Automotive interfaces:

• Sixteen Modular Controller Area Network (MCAN)

modules with full CAN-FD support

Audio interfaces:

• Twelve Multichannel Audio Serial Port (MCASP)

modules

Flash memory interfaces:

• Embedded MultiMediaCard interface ( eMMC™

5.1)

• Universal Flash Storage (UFS 2.1) interface with

two lanes

• Two Secure Digital® 3.0/Secure Digital Input

Output 3.0 interfaces (SD3.0/SDIO3.0)

• Two simultaneous flash interfaces configured as

– One OSPI and one QSPI flash interfaces

– or one HyperBus™ and one QSPI flash

interface

System-on-Chip (SoC) architecture:

• 16-nm FinFET technology

• 24 mm × 24 mm, 0.8-mm pitch, 827-pin FCBGA

(ALF), enables IPC class 3 PCB routing

TPS6594-Q1 Companion Power Management

ICs (PMIC):

• Functional Safety support up to ASIL-D

• Flexible mapping to support different use cases

2 Applications

• Automotive gateway

• Body control module

• Industrial transport

• Industrial robot

• High-end PLC

3 Description

DRA829 processors, based on the Arm®v8 64-bit architecture, provide advanced system integration to enable

lower system costs of automotive and industrial applications. The integrated diagnostics and functional safety

features are targeted to ASIL-B/C or SIL-2 certification/requirements. The integrated microcontroller (MCU)

island eliminates the need for an external system MCU. The device features a Gigabit Ethernet switch and

a PCIe® hub which enables networking use cases that require heavy data bandwidth. Up to four Arm®

Cortex®-R5F subsystems manage low level, timing critical processing tasks leaving the Arm® Cortex®-A72’s

unencumbered for applications. A dual-core cluster configuration of Arm® Cortex®-A72 facilitates multi-OS

applications with minimal need for a software hypervisor..