DRA821U2...ALM中文资料德州仪器数据手册PDF规格书

1 Features

Processor cores:

• Dual 64-bit Arm® Cortex®-A72 microprocessor

subsystem at up to 2.0 GHz, 24K DMIPS

– 1MB L2 shared cache per dual-core Cortex®-

A72 cluster

– 32KB L1 DCache and 48KB L1 ICache per A72

core

• 4× Arm® Cortex®-R5F MCUs at up to 1.0 GHz with

optional lockstep operation, 8K DMIPS

– 32K I-Cache, 32K D-Cache, 64K L2 TCM

– 2× Arm® Cortex®-R5F MCUs in isolated MCU

subsystem

– 2× Arm® Cortex®-R5F MCUs in general

compute partition

Memory subsystem:

• 1MB of On-Chip L3 RAM with ECC and coherency

– ECC error protection

– Shared coherent cache

– Supports internal DMA engine

• External Memory Interface (EMIF) module with

ECC

– Supports LPDDR4 memory types that comply

with the JESD209-4B specification. (No support

for byte mode LPDDR4 memories, or memories

with more than 17 row address bits)

– Supports speeds up to 3200 MT/s

– 32-bit and 16-bit data bus with inline ECC bus

up to 12.8GB/s

• General-Purpose Memory Controller (GPMC)

• 512KB on-chip SRAM in MAIN domain, protected

by ECC

Virtualization:

• Hypervisor support in Arm® Cortex®-A72

• Independent processing subsystems with Arm®

Cortex®-A72, Arm® Cortex®-R5F with isolated

safety MCU island

• IO virtualization support

– Peripheral Virtualization Unit (PVU) for low

latency high bandwidth peripheral traffic

• Multi-region firewall support for memory and

peripheral isolation

• Virtualization support with Ethernet, PCIe, and

DMA

• Device security (on select part numbers):

• Secure boot with secure runtime support

• Customer programmable root key, up to RSA-4K

or ECC-512

• Embedded hardware security module

• Crypto hardware accelerators – PKA with ECC,

AES, SHA, RNG, DES and 3DES

Functional Safety:

• Functional Safety-Compliant targeted (on select

part numbers)

– Developed for functional safety applications

– Documentation will be available to aid ISO

26262 and IEC 61508 functional safety system

design up to ASIL-D/SIL-3 targeted

– Systematic capability up to ASIL-D/SIL-3

targeted

– Hardware integrity up to ASIL-D/SIL-3 targeted

for MCU Domain

– Hardware integrity up to ASIL-D/SIL-3 targeted

for Extended MCU (EMCU) portion of the Main

Domain

– Hardware integrity up to ASIL-B/SIL-2 targeted

for remainder of the Main Domain

– FFI isolation provided between EMCU and the

remainder of the Main Domain

– Safety-related certification

• ISO 26262 and IEC 61508 planned

• AEC-Q100 qualified on part number variants

ending in Q1

• High-speed interfaces:

– Integrated Ethernet TSN/AVB switch supporting

up to 4 (DRA821U4) or 2 (DRA821U2) external

ports:

• One port supports 5Gb, 10Gb USXGMII/XFI

• All ports support 2.5Gb SGMII

• All ports support 1Gb SGMII/RGMII

• DRA821U4: Any single port can support

QSGMII (using all 4 internal ports)

• Non-blocking wire-rate store and forward

switch

• InterVLAN (Layer3) routing support

• Time synchronization support with IEEE

1588(annex D,E,F)

• TSN/AVB support for traffic scheduling,

shaping

• Port mirroring feature for debug and

diagnostics

• Policing and rate limiting support

– One RGMII/RMII port in safety MCU island

• One PCI-Express® Gen3 controller

– Gen1, Gen2, and Gen3 operation with autonegotiation

– 4× lanes

• One USB 3.1 Gen1 dual-role device subsystem

– Supports type-C switching

– Independently configurable as USB host, USB

peripheral, or USB dual-role device

Automotive interfaces:

• Twenty CAN-FD ports

• 12× Universal Asynchronous Receiver/Transmitter

(UART)

• 11× Serial Peripheral Interfaces (SPI)

• One 8-channel ADC

• 10× Inter-Integrated Circuit ( I2C™)

• 2× Improved Inter-Integrated Circuit ( I3C®)

Audio interfaces:

• 3× Multichannel Audio Serial Port (McASP)

modules

Flash memory interfaces:

• Embedded Multi Media Card ( eMMC™ 5.1)

interface

– Support speeds of up to HS400

• One Secure Digital® 3.0/Secure Digital Input

Output 3.0 (SD3.0/SDIO3.0) interfaces

• One Octal SPI / Xccela™ / HyperBus™ Memory

Controller (HBMC) interface

• 16-nm FinFET technology

• 17.2 mm x 17.2 mm, 0.8 mm pitch, IPC Class 3

PCB

2 Applications

• Automotive gateway

• Vehicle compute

• Body control module

• Telematics control unit

• V2X/V2V

• Factory automation gateways

• Communications equipment

• Industrial transport

• Building Automation Gateway

3 Description

Jacinto™ DRA821x processors, based on the Armv8 64-bit architecture, are optimized for gateway systems

with cloud connectivity. The System-on-Chip (SoC) design reduces system-level costs and complexity through

integration—notably, a system MCU, functional safety and security features, and an Ethernet switch for highspeed

communication. Integrated diagnostics and functional safety features are targeted to ASIL-D and SIL 3

certification requirements. Real-time control and low-latency communication are enabled by a PCIe controller

and a TSN capable Gigabit Ethernet switch.

Up to four general-purpose Arm® Cortex®-R5F subsystems can handle low-level, timing-critical processing

tasks and leave the Arm® Cortex®-A72 core unencumbered for advanced and cloud-based applications.

Jacinto DRA821x processors also include the concept of the Extended MCU (eMCU) domain. This domain is a

subset of the processors and peripherals on the main domain targeted at higher functional safety enablement,

such as ASIL-D/SIL-3. The functional block diagram highlights which IP are included in the eMCU. For more

details about eMCU and functional safety, see the DRA821 Safety Manual Processors Texas Instruments

Jacinto™ 7 Family of Products (SPRUIX4).