High Insulation DIP Relay

[GCC] Features • Molded Epoxy Body • DIP type construction with the same terminal pitch as ICs or TTLs simplifies designing. • High sensitivity allows for direct driving by TTLs, etc. • High Breakdown: 4KV between coil and contact • Sealed construction for automatic flow soldering and cleani

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SIP REED RELAY

[GCC] ■ Features • Molded epoxy body • High isolation coil/contact • Can make high voltage contact • Sealed construction permits automatic flow soldering and cleaning

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IXYS
整流器,模块

IXYS

艾赛斯

上传：深圳市凌旭科技有限公司

INTEL(英特尔)

INTEL(英特尔)

上传：深圳市盈慧通电子有限公司

INTEL(英特尔)

INTEL(英特尔)

上传：深圳市盈慧通电子有限公司