DF2S12P2FU中文资料东芝数据手册PDF规格书

Applications

Mobile Equipment

Smartphones

Tablets

Notebook PCs

Desktop PCs

Features

(1) Suitable for use with a 9 V signal line. (VRWM ≤ 10 V)

(2) Protects devices with its high ESD performance.

(VESD = ±30 kV (Contact / Air) @IEC61000-4-2)

(3) Low dynamic resistance protects semiconductor devices from static electricity and noise.

(RDYN = 0.08 Ω (typ.))

(4) Snapback characteristics realizing low clamping voltage protects semiconductor devices.

(VC = 30 V@IPP = 60 A (typ.))

(5) Compact package is suitable for use in high density board layouts such as in mobile devices.

(2.5 mm × 1.25 mm size (Nickname: USC))