DUV310-CHIP

DeepUltravioletLightEmissionSource

DWC310

DualBiasResistorTransistors

DWX310

DualBiasResistorTransistors

DXK310

GlassPassivatedBridgeRectifier

Features Idealforprintedcircuitboards ULrecognitionfilenumberE526209 LeadfreeincompliancewithEURoHS2.0 Halogen-freeaccordingtoIEC61249standard MechanicalData Case:DXKPackage Terminals:SolderableperMIL-STD-750,Method2026 Approx.Weight:1.29gr

E310A

LowCostPrecisionReference

[THALERCORPORATION] LowCostPrecisionReference

EC310

Modular-DesignedEmbeddedSystem

ECM-CFS-H310

8th/9thGenCoffeeLake-S3.5”MicroModule

Features •TopLayerSolderedSocket•Supports9th/8thGenIntel®CoffeeLake-SCoreTM/ Pentium®/Celeron®Processors•Intel®Q370/H310ExpressChipset•Intel®UHDGraphics630/610•SingleDRAMSocket,Max.Upto32GBDDR42666MHz•TripleDisplay(2xHDMI,LVDS)•2xUSB2.0,4xUSB3.1(

ECPSM310T

CRYSTAL

ECT310

EnOceanpoweredbyThermalEnergy

ECT310keyfeatures Bestin-classThermoHarvestersolution Low-costDC/DCconverter,workswith lowest-coststandardPeltierelements Designedandoptimizedforthermopowered EnOceanwirelessapplications SMDfootprint DirectlytobesolderedontoEnOceanSTM 312wirelesssen

EE310

High-EndHumidityandTemperatureSensorforIndustrialApplications

Features TheE+Eproprietarysensorcoatingisaprotectivelayerappliedtothesensingelements,theirleadsandsolderingpoints. Thecoatingsubstantiallyextendssensorlifetimeandensuresoptimalmeasurementperformanceincorrosiveenvironment (salts,off-shoreapplications).Addition