DAC5675-EP数据手册TI中文资料规格书

特性 Features

• 400-MSPS Update Rate
• Controlled Baseline
- One Assembly
• One Test Site
• One Fabrication Site
• Extended Temperature Performance of -55°C to 125°C
• Enhanced Diminishing Manufacturing Sources (DMS) Support
• Enhanced Product-Change Notification
• LVDS-Compatible Input Interface
• Spurious-Free Dynamic Range (SFDR) to Nyquist
- 69 dBc at 70 MHz IF, 400 MSPS
• W-CDMA Adjacent Channel Power Ratio (ACPR)
- 73 dBc at 30.72-MHz IF, 122.88 MSPS
• 71 dBc at 61.44-MHz IF, 245.76 MSPS
• Differential Scalable Current Outputs: 2 mA to 20 mA
• On-Chip 1.2-V Reference
• Single 3.3-V Supply Operation
• Power Dissipation: 660 mW at fCLK = 400 MSPS, fOUT = 20 MHz
• Package: 48-Pin PowerPAD Thermally-Enhanced Thin Quad Flat Pack (HTQFP) TJA = 29.1°C/W
• APPLICATIONS
- Cellular Base Transceiver Station Transmit Channel:
- CDMA: WCDMA, CDMA2000, IS-95
• TDMA: GSM, IS-136, EDGE/GPRS
• Supports Single-Carrier and Multicarrier Applications
• Test and Measurement: Arbitrary Waveform Generation
• Military Communications
PowerPAD is a trademark of Texas Instruments.