DA1470X中文资料瑞萨数据手册PDF规格书

Key Features

■ Compatible with Bluetooth® 5.2, ETSI EN

300 328 and EN 300 440 Class 2 (Europe),

FCC CFR47 Part 15 (US) and ARIB STDT66

(Japan)

■ Flexible processing power

□ 32 kHz up to 160 MHz 32-bit Arm

Cortex-M33 with 8 kB, four-way

associative cache, FPU and eightsegments

MPU

□ A flexible and configurable Bluetooth®

Low Energy MAC engine implementing

the controller stack up to HCI

□ An Arm Cortex M0+ based sensor node

controller for sensors manipulation

□ A 2D GPU for advanced graphics

processing

□ Optimized power modes (Extended

sleep, Deep sleep, and Hibernation)

■ Memories

□ 1.5 MB Data SRAM with retention

□ 4 kB One-Time-Programmable (OTP)

memory for secure key storage

□ 8 kB ICache SRAM with retention

□ 8 kB DCache 10-Nov-2022SRAM with retention

□ 32 kB ROM (boot, PKI routines)

■ Power management

□ Low Iq SIMO Buck DC-DC converter

□ Boost DC-DC converter (4.5 V – 5.0 V)

□ Four power supply pins for external

devices DCDC supported

□ Hardware charger (up to 5.0 V) with

programmable curves and JEITA

support

□ Integrated Power Path Management