D22中文资料意法半导体数据手册PDF规格书
D22规格书详情
DESCRIPTION
Memory Cards consist of two main parts: the plastic card, and the embedded Micromodule (which, in turn, carries the silicon chip).
■ Micromodules were developed specifically for
embedding in Smartcards and Memory Cards
■ The Micromodule provides:
– Support for the chip
– Electrical contacts
– Suitable embedding interface for gluing the
module to the plastic package
■ Physical dimensions and contact positions
compliant to the ISO 7816 standard
■ Micromodules delivered as a continuous Super
35 mm tape. (This differs from the standard
35 mm tape in the spacing distance between
the indexing holes.)
产品属性
- 型号:
D22
- 制造商:
STMICROELECTRONICS
- 制造商全称:
STMicroelectronics
- 功能描述:
Memory Micromodules General Information for D1, D2 and C Packaging
供应商 | 型号 | 品牌 | 批号 | 封装 | 库存 | 备注 | 价格 |
---|---|---|---|---|---|---|---|
Infineon/英飞凌 |
21+ |
BG-D7526K0-1 |
6820 |
只做原装,质量保证 |
询价 | ||
23+ |
MODULE |
7300 |
专注配单,只做原装进口现货 |
询价 | |||
INFINEON |
23+ |
7000 |
询价 | ||||
Infineon |
2022+ |
原厂原包装 |
8600 |
全新原装 支持表配单 中国著名电子元器件独立分销 |
询价 | ||
Infineon/英飞凌 |
2022+ |
BG-D7526K-1 |
48000 |
只做原装,绝对原装,假一罚十 |
询价 | ||
原装 |
专业模块 |
MODULE |
8513 |
模块原装主营-可开原型号增税票 |
询价 | ||
Infineon/英飞凌 |
2023+ |
BG-D7526K0-1 |
6000 |
原装正品现货、支持第三方检验、终端BOM表可配单提供 |
询价 | ||
Infineon |
23+ |
标准封装 |
5000 |
原厂授权一级代理 IGBT模块 可控硅 晶闸管 熔断器质保 |
询价 | ||
Infineon Technologies |
24+ |
原装 |
5000 |
原装正品,提供BOM配单服务 |
询价 | ||
Infineon/英飞凌 |
24+ |
BG-D7526K0-1 |
6000 |
全新原装深圳仓库现货有单必成 |
询价 |