D1B050D中文资料ETC数据手册PDF规格书
D1B050D规格书详情
Features
Molded epoxy body
DIP type construction with the same terminal pitch as
ICs or TTLs simplifies PC board designing. In addition,
the high sensitivity allows direct driving by TTL, etc.
Automatic insertion compatible
Sealed construction permits automatic flow soldering and cleaning
Magnetic shield is available
产品属性
- 型号:
D1B050D
- 功能描述:
DIP REED RELAY
供应商 | 型号 | 品牌 | 批号 | 封装 | 库存 | 备注 | 价格 |
---|---|---|---|---|---|---|---|
DIBCOM |
23+ |
BGA |
3000 |
一级代理原厂VIP渠道,专注军工、汽车、医疗、工业、 |
询价 | ||
台湾冠西 |
19+ |
DIP |
68660 |
原厂代理渠道,每一颗芯片都可追溯原厂; |
询价 | ||
KUANHSI |
07+ |
DIP |
825 |
原装 |
询价 | ||
COSMO |
23+ |
7300 |
专注配单,只做原装进口现货 |
询价 | |||
DIBCOM |
22+ |
BGA |
6000 |
进口原装 假一罚十 现货 |
询价 | ||
DIBCOM |
25+ |
BGA |
880000 |
明嘉莱只做原装正品现货 |
询价 | ||
DIBCOM |
24+ |
BGA |
30000 |
房间原装现货特价热卖,有单详谈 |
询价 | ||
cosmo |
23+ |
继电器 |
9896 |
询价 | |||
冠西 |
24+ |
5000 |
全新原装 |
询价 | |||
DIBCOM |
12+ |
BGA |
31050 |
所有报价以当天为准 |
询价 |