3300-3670 MHz, 31 dB, 10.7 W Avg. AIRFAST POWER AMPLIFIER MODULE

Features • 2−stage module solution that includes an LDMOS integrated circuit as a driver and a GaN final stage amplifier • Advanced high performance in−package Doherty • Thermal path is separated from electrical/solder connection path for enhanced thermal dissipation • Fully matched (50 ohm

文件：220.04 Kbytes 页数：17 Pages

恩XP

null3400–3600 MHz, 30 dB, 10.5 W Avg. AIRFAST POWER AMPLIFIER MODULE

Features • 2−stage module solution that includes an LDMOS integrated circuit as a driver and a GaN final stage amplifier • Advanced high performance in−package Doherty • Thermal path is separated from electrical/solder connection path for enhanced thermal dissipation • Fully matched (50 ohm

文件：223.18 Kbytes 页数：17 Pages

恩XP

ZIP

SHINDNE

上传：深圳市亚泰盈科电子有限公司

SMA

SHINDENGEN

上传：深圳市粤科源兴科技有限公司

NA

SHINDENGE

上传：深圳权泰科技有限公司