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CYP15G0402DXB-BGC集成电路(IC)的电信规格书PDF中文资料

CYP15G0402DXB-BGC
厂商型号

CYP15G0402DXB-BGC

参数属性

CYP15G0402DXB-BGC 封装/外壳为256-BGA 裸露焊盘;包装为托盘;类别为集成电路(IC)的电信;产品描述:IC TELECOM INTERFACE 256BGA

功能描述

Quad HOTLink II??SERDES

封装外壳

256-BGA 裸露焊盘

文件大小

615.39 Kbytes

页面数量

29

生产厂商 CypressSemiconductor
企业简称

CYPRESS赛普拉斯

中文名称

赛普拉斯半导体公司官网

原厂标识
数据手册

下载地址一下载地址二到原厂下载

更新时间

2025-7-1 20:00:00

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CYP15G0402DXB-BGC价格和库存,欢迎联系客服免费人工找货

CYP15G0402DXB-BGC规格书详情

Functional Description

The CYP(V)15G0402DXB[1] Quad HOTLink II™ SERDES is a point-to-point communications building block allowing the transfer of preencoded data over high-speed serial links (optical fiber, balanced, and unbalanced copper transmission lines) at signaling speeds ranging from 195 to 1500 MBaud per serial link.

Features

• Second-generation HOTLink® technology

• Compliant to multiple standards

— Fibre Channel, Gigabit Ethernet (IEEE802.3z), ESCON® and DVB-ASI

— CYV15G0402DXB compliant to SMPTE 259M and SMPTE 292M

• Quad-channel transceiver operates from 195 to 1500 Mbps serial data rate

— Aggregate throughput of 12 Gbps

• 10-bit unencoded data transport

• Selectable parity check/generate

• Four independent 10-bit channels with separate Clock and Data Recovery for each channel

• Selectable input clocking options

• MultiFrame™ Receive Framer

— Comma or full K28.5 detect

— Single or Multi-Byte framer for byte alignment

— Low-latency option

• Synchronous LVTTL parallel interface

• Internal phase-locked loops (PLLs) with no external PLL components

• Optional Phase Align Buffer in Transmit Path

• Differential PECL-compatible serial inputs

• Differential PECL-compatible serial outputs

— Source matched for 50Ω transmission lines

— No external resistors required

— Signaling rate controlled edge rates

• Compatible with

— Fiber-optic modules

— Copper cables

— Circuit board traces

• JTAG boundary scan

• Built-In Self-Test (BIST) for at-speed link testing

• Per-channel Link Quality Indicator

— Analog signal detect

— Digital signal detect

• Low-power 2.5W @3.3V typical

• Single 3.3V supply

• 256-ball thermally enhanced BGA

• Pb-Free package option available

• 0.25µ BiCMOS technology

产品属性

  • 产品编号:

    CYP15G0402DXB-BGC

  • 制造商:

    Cypress Semiconductor Corp

  • 类别:

    集成电路(IC) > 电信

  • 系列:

    HOTlink II™

  • 包装:

    托盘

  • 接口:

    LVTTL

  • 电压 - 供电:

    3.135V ~ 3.465V

  • 电流 - 供电:

    830mA

  • 工作温度:

    0°C ~ 70°C

  • 安装类型:

    表面贴装型

  • 封装/外壳:

    256-BGA 裸露焊盘

  • 供应商器件封装:

    256-L2BGA(27x27)

  • 描述:

    IC TELECOM INTERFACE 256BGA

供应商 型号 品牌 批号 封装 库存 备注 价格
CYPRESS/赛普拉斯
25+
BGA256
65248
百分百原装现货 实单必成
询价
CYPRESS
0321+
BGA
40
一级代理,专注军工、汽车、医疗、工业、新能源、电力
询价
CYPRESS
2018+
BGA256
11256
只做进口原装正品!假一赔十!
询价
CYPRESS/赛普拉斯
2021+
BGA256
300
十年专营原装现货,假一赔十
询价
CYPRESS
2138+
原厂标准封装
8960
代理CYPRESS全系列芯片,原装现货
询价
CYPRESS
2015+
SOP/QFP/PLCC
19889
一级代理原装现货,特价热卖!
询价
CYPRESS
25+23+
BGA256
20783
绝对原装正品全新进口深圳现货
询价
CYPRESS
22+
BGA
8000
原装正品支持实单
询价
CYPRESS
23+
NA
3200
专业电子元器件供应链正迈科技特价代理QQ1304306553
询价
CYPRESS/赛普拉斯
09+
BGA256
300
全新进口原装
询价