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CY7C1420KV18-250BZI中文资料PDF规格书

CY7C1420KV18-250BZI
厂商型号

CY7C1420KV18-250BZI

参数属性

CY7C1420KV18-250BZI 封装/外壳为165-LBGA;包装为托盘;类别为集成电路(IC) > 存储器;产品描述:IC SRAM 36MBIT PARALLEL 165FBGA

功能描述

36-Mbit DDR II SRAM 2-Word Burst Architecture

文件大小

1.32429 Mbytes

页面数量

32

生产厂商 CypressSemiconductor
企业简称

Cypress赛普拉斯

中文名称

赛普拉斯半导体公司官网

原厂标识
数据手册

下载地址一下载地址二到原厂下载

更新时间

2024-6-24 22:30:00

CY7C1420KV18-250BZI规格书详情

Functional Description

The CY7C1416KV18, CY7C1427KV18, CY7C1418KV18, and CY7C1420KV18 are 1.8 V synchronous pipelined SRAM equipped with DDR II architecture. The DDR II consists of an SRAM core with advanced synchronous peripheral circuitry and a 1-bit burst counter.

Features

■ 36-Mbit density (4 M × 8, 4 M × 9, 2 M × 18, 1 M × 36)

■ 333 MHz clock for high bandwidth

■ 2-word burst for reducing address bus frequency

■ Double data rate (DDR) interfaces (data transferred at 666 MHz) at 333 MHz

■ Two input clocks (K and K) for precise DDR timing

❐ SRAM uses rising edges only

■ Two input clocks for output data (C and C) to minimize clock skew and flight time mismatches

■ Echo clocks (CQ and CQ) simplify data capture in high speed systems

■ Synchronous internally self-timed writes

■ DDR II operates with 1.5 cycle read latency when DOFF is asserted HIGH

■ Operates similar to DDR-I device with 1 cycle read latency when DOFF is asserted LOW

■ 1.8 V core power supply with HSTL inputs and outputs

■ Variable drive HSTL output buffers

■ Expanded HSTL output voltage (1.4 V to VDD)

❐ Supports both 1.5 V and 1.8 V IO supply

■ Available in 165-ball FBGA package (13 × 15 × 1.4 mm)

■ Offered in both Pb-free and non Pb-free packages

■ JTAG 1149.1 compatible test access port

■ Phase locked loop (PLL) for accurate data placement

产品属性

  • 产品编号:

    CY7C1420KV18-250BZI

  • 制造商:

    Cypress Semiconductor Corp

  • 类别:

    集成电路(IC) > 存储器

  • 包装:

    托盘

  • 存储器类型:

    易失

  • 存储器格式:

    SRAM

  • 技术:

    SRAM - 同步,DDR II

  • 存储容量:

    36Mb(1M x 36)

  • 存储器接口:

    并联

  • 电压 - 供电:

    1.7V ~ 1.9V

  • 工作温度:

    -40°C ~ 85°C(TA)

  • 安装类型:

    表面贴装型

  • 封装/外壳:

    165-LBGA

  • 供应商器件封装:

    165-FBGA(13x15)

  • 描述:

    IC SRAM 36MBIT PARALLEL 165FBGA

供应商 型号 品牌 批号 封装 库存 备注 价格
CYPRESS
2018+
BGA
6000
全新原装正品现货,假一赔佰
询价
CYPRESS
23+
165FBGA
4568
原厂原装正品现货,代理渠道,支持订货!!!
询价
CYPRESS
23+
NA
1221
专业电子元器件供应链正迈科技特价代理QQ1304306553
询价
CYPRESS/赛普拉斯
23+
NA
2000
只做原装 深圳公司现货 十年信誉
询价
CYPRESS
22+
FBGA
10000
原装正品优势现货供应
询价
CYPRESS
2016+
FBGA165
3526
假一罚十进口原装现货原盘原标!
询价
CYPRESS
21+
BGA
215
原装现货假一赔十
询价
CYPRESS
2021+
165FBGA
1685
只做原装假一罚十
询价
Cypress
23+
165-FBGA(13x15)
73390
专业分销产品!原装正品!价格优势!
询价
SPANSION(飞索)
1921+
FBGA-165(13x15)
3575
向鸿仓库现货,优势绝对的原装!
询价