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CY7C1320KV18-250BZC中文资料PDF规格书

CY7C1320KV18-250BZC
厂商型号

CY7C1320KV18-250BZC

参数属性

CY7C1320KV18-250BZC 封装/外壳为165-LBGA;包装为托盘;类别为集成电路(IC) > 存储器;产品描述:IC SRAM 18MBIT PARALLEL 165FBGA

功能描述

18-Mbit DDR II SRAM Two-Word Burst Architecture

文件大小

1.0195 Mbytes

页面数量

32

生产厂商 CypressSemiconductor
企业简称

Cypress赛普拉斯

中文名称

赛普拉斯半导体公司官网

原厂标识
数据手册

下载地址一下载地址二到原厂下载

更新时间

2024-6-21 17:04:00

CY7C1320KV18-250BZC规格书详情

Functional Description

The CY7C1316KV18, CY7C1916KV18, CY7C1318KV18, and CY7C1320KV18 are 1.8 V synchronous pipelined SRAM equipped with DDR II architecture. The DDR II consists of an SRAM core with advanced synchronous peripheral circuitry and a 1-bit burst counter.

Features

■ 18-Mbit density (2 M × 8, 2 M × 9, 1 M × 18, 512 K × 36)

■ 333-MHz clock for high bandwidth

■ Two-word burst for reducing address bus frequency

■ Double data rate (DDR) interfaces (data transferred at 666 MHz) at 333 MHz

■ Two input clocks (K and K) for precise DDR timing

❐ SRAM uses rising edges only

■ Two input clocks for output data (C and C) to minimize clock skew and flight time mismatches

■ Echo clocks (CQ and CQ) simplify data capture in high-speed systems

■ Synchronous internally self-timed writes

■ DDR II operates with 1.5 cycle read latency when DOFF is asserted HIGH

■ Operates similar to DDR-I device with 1 cycle read latency when DOFF is asserted LOW

■ 1.8 V core power supply with HSTL inputs and outputs

■ Variable drive HSTL output buffers

■ Expanded HSTL output voltage (1.4 V–VDD)

❐ Supports both 1.5 V and 1.8 V I/O supply

■ Available in 165-ball FBGA package (13 × 15 × 1.4 mm)

■ Offered in both Pb-free and non Pb-free packages

■ JTAG 1149.1 compatible test access port

■ Phase locked loop (PLL) for accurate data placement

产品属性

  • 产品编号:

    CY7C1320KV18-250BZC

  • 制造商:

    Cypress Semiconductor Corp

  • 类别:

    集成电路(IC) > 存储器

  • 包装:

    托盘

  • 存储器类型:

    易失

  • 存储器格式:

    SRAM

  • 技术:

    SRAM - 同步,DDR II

  • 存储容量:

    18Mb(512K x 36)

  • 存储器接口:

    并联

  • 电压 - 供电:

    1.7V ~ 1.9V

  • 工作温度:

    0°C ~ 70°C(TA)

  • 安装类型:

    表面贴装型

  • 封装/外壳:

    165-LBGA

  • 供应商器件封装:

    165-FBGA(13x15)

  • 描述:

    IC SRAM 18MBIT PARALLEL 165FBGA

供应商 型号 品牌 批号 封装 库存 备注 价格
CYPRESS(赛普拉斯)
23+
LBGA165
7350
现货供应,当天可交货!免费送样,原厂技术支持!!!
询价
Cypress
23+
165FBGA (13x15)
9000
原装正品,支持实单
询价
Cypress
23+
165-FBGA(13x15)
209250
专业分销产品!原装正品!价格优势!
询价
CYPRESS
BGA
68900
原包原标签100%进口原装常备现货!
询价
CypressSemiconductorCorp
2022
ICSRAM512X361.8VSYNC165F
5058
原厂原装正品,价格超越代理
询价
CYPRESS
2016+
FBGA165
3526
假一罚十进口原装现货原盘原标!
询价
CYPRESS
22+
FBGA
10000
原装正品优势现货供应
询价
Cypress
22+
NA
42
加我QQ或微信咨询更多详细信息,
询价
Cypress
FBGA165
6000
原装现货,长期供应,终端可账期
询价
Cypress
22+/23+
165-FBGA(13x15)
9800
原装进口公司现货假一赔百
询价