CWR09MC105KCB电容器的钽电容器规格书PDF中文资料

CWR09MC105KCB属于电容器的钽电容器。由日本京瓷株式会社制造生产的CWR09MC105KCB钽电容器电容器是一种用于存储电荷的无源电子器件。钽电容器具有由钽金属制成的阳极 (+)、充当阴极的电解质和充当电介质的氧化钽绝缘薄层。钽电容器在低重量下提供较高的每单位体积电容电压 (CV) 乘积，并且以高可靠性著称。

This is the original high reliability molded

tantalum chip series and the case sizes still

represent the most flexible of surface mount

form factors. TAZ offers nine case sizes,

eight of which (A through H) are fully qualified

to MILPRF-55365/4, and also includes the

original sub-miniature R case (non-QPL).

This series is fully interchangeable with CWR06

conformal types, while offering the advantages of

molded body/compliant termination construction

(ensuring no TCE mismatch with any substrate).

This construction is compatible with a wide range

of SMT board assembly processes including

convection reflow solder, conductive epoxy or

compression bonding techniques.

The parts also carry full polarity and capacitance

/ voltage marking. The five smaller cases are

characterized by their low profile construction,

with the A case being the world’s smallest

molded military tantalum chip.

All 4V to 50V ratings are qualified to MILPRF-55365 Weibull “B”, “C”, “D” and “T” levels,

with all surge options (“A”, “B” & “C”) available.

For Space Level applications, KYOCERA AVX SRC

9000 qualification is recommended (see ratings

table for part number availability).

There are four termination finishes available: solder

plated, fused solder plated, hot solder dipped and

gold plated (these are “H”, “K”, “C” and “B” termination,

respectively, per MIL-PRF-55365). In addition, the

molding compound has been selected to meet the

requirements of UL94V-0 (Flame Retardancy) and

outgassing requirements of ASTM E-595.

For moisture sensitivity levels please refer to the

High Reliability Tantalum MSL section located in the

back of the High Reliability Tantalum Catalog