首页 >CVP5240(CVP30X32)>规格书列表
| 零件编号 | 下载 订购 | 功能描述/丝印 | 制造商 上传企业 | LOGO |
|---|---|---|---|---|
EmbeddedPCwithIntelAtom짰processor | BECKHOFFBeckhoff Automation GmbH & Co. KG 倍福自动化 | BECKHOFF | ||
SMDZenerDiode Voltage:2.4to75Volts Power:150mWatts RoHSDevice Features -Forsurfacemountedapplications. -150mWPowerDissipation. -Ideallysuitedforautomatedassemblyprocesses. -Pbfreeproduct. Mechanicaldata -Case:SOD-523,Moldedplastic. -Terminals:SolderPlated,solderableper | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
SurfaceMountZenerDiodes | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
SurfaceMountZenerDiodes | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
SMDZenerDiode | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
SurfaceMountZenerDiodes Voltage:2.4-39Volts Power:500mWatts Features PlanarDieconstruction 500mWPowerDissipation ZenerVoltagesfrom2.4V–39V IdeallySuitedforAutomatedAssemblyProcesses | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
SMDZenerDiode Voltage:2.4to39Volts Power:350mWatts RoHSDevice Features Planardieconstruction 350mWpowerdissipationonFR-4PCB) Ideallysuitedforautomatedassemblyprocess Generalpurpose,mediumcurrent | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
SMDZenerDiode Voltage:2.4to39Volts Power:350mWatts RoHSDevice HalogenFree Features -Planardieconstruction -350mWpowerdissipationonFR-4PCB -Ideallysuitedforautomatedassemblyprocess -Generalpurpose,mediumcurrent Mechanicaldata -Case:SOT-23,Moldedplastic -Terminals:Sold | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
SMDZenerDiode | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
SurfaceMountZenerDiodes Voltage:2.4~29Volts Power:500mW Features: ●PlanarDieConstructions ●500mWPowerDissipation ●ZenerVoltagesfrom2.4V~39V ●IdeallySuitedforAutomatedAssemblyProcesses | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP |
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