首页 >CTCN085V0-G>规格书列表
| 零件编号 | 下载 订购 | 功能描述/丝印 | 制造商 上传企业 | LOGO |
|---|---|---|---|---|
SMDESDProtectionDiode RoHSDevice HalogenFree Features -Bi-directionalESDprotection. -Operatingvoltage:5V. Mechanicaldata -Case:SOT-383Fstandardpackage,moldedplastic. -Terminals:Goldplated,solderableperMIL-STD-750D,method2026. -Markingcode:E05 -Mountingposition:Any. | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
SMDESDProtectionDiode RoHSDevice HalogenFree Features -Bi-directionalESDprotection -IEC61000-4-5(surge);IPP=7A -IEC61000-4-2(ESD);±30KV(contact) -Lowclampingvoltage -Lowleakagecurrent Mechanicaldata -Case:SOT-383Fstandardpackage,moldedplastic. -Terminals:Goldplated,solderablep | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
SMDESDProtectionDiode Features -CommonanodeESDprotection -IEC61000-4-28kV(contact),15kV(air). -Surfacemountpackage. -Highcomponentdensity. Mechanicaldata -Case:SOT-383FStandardpackage,moldedplastic. -Terminals:Nipd,solderableperMIL-STD-750,method2026. -MarkingCode:E5U -Mounting | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
SMDESDProtectionDiode Features -CommonanodeESDprotection -Surfacemountpackage. -Highcomponentdensity Mechanicaldata -Case:SOT-383FStandardpackage,moldedplastic. -Terminals:Goldplated,solderableperMIL-STD-750,method2026. -MarkingCode:E5U -Mountingposition:Any. | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
SMDESDProtectionDiode RoHSDevice HalogenFree Features -CommonanodeESDprotection -Surfacemountpackage. -Highcomponentdensity. Mechanicaldata -Case:SOT-383Fstandardpackage,moldedplastic. -Terminals:Goldplated,solderableperMIL-STD-750,method2026. -MarkingCode:E5U -Mountingpositio | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
ESDProtectionArray | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP |
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