Low VF Schottky Diode Chip

PROCESS DETAILS Die Size 8.3 x 8.3 MILS Die Thickness 3.9 MILS Anode Bonding Pad Area 5.4 x 5.4 MILS Top Side Metalization Al - 20,000Å Back Side Metalization Au - 12,000Å

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Low VF Schottky Diode Chip

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