CP3SP33中文资料具有缓存、DSP、蓝牙、USB、双路 CAN 接口的处理器数据手册TI规格书

描述 Description

The CP3SP33 connectivity processor combines high performance with the massive integration needed for embedded Bluetooth applications. A powerful RISC core with 4Kbyte instruction cache and a Teak® DSP coprocessor provides high computing bandwidth, DMA-driven hardware communications peripherals provide high I/O bandwidth, and an external bus provides system expandability.

On-chip communications peripherals include: Bluetooth Lower Link Controller, Universal Serial Bus (2.0) OTG node and host controller, dual CAN, dual Microwire/Plus/SPI, dual ACCESS.bus, quad UART, 10-bit A/D converter, and telematics/audio codec. Additional on-chip peripherals include DMA controller, dual CVSD/PCM conversion module, I2S and AAI digital audio bus interfaces, Timing and Watchdog Unit, dual Versatile Timer Unit, dual Multi-Function Timer, and Multi-Input Wake-Up (MIWU) unit.

In addition to providing the features needed for the next generation of embedded Bluetooth products, the CP3SP33 is backed up by the software resources that designers need for rapid time-to-market, including an operating system, Bluetooth protocol stack implementation, peripheral drivers, reference designs, and an integrated development environment. Combined with an external program memory and a Bluetooth radio transceiver such as National’s LMX5252, the CP3SP33 provides a complete Bluetooth system solution.

National Semiconductor offers a complete and industry proven application development environment for CP3SP33 applications, including the IAR Embedded Workbench, iSYSTEM winIDEA and iC3000 Active Emulator, Bluetooth Development Board, Bluetooth protocol stack, and application examples.

特性 Features

• CPU Features
• Minimum 10.4 ns instruction cycle time with a 96-MHz internal clock frequency, based on a 12-MHz external input
• 69 independently vectored peripheral interrupts
• DSP Features
• 16-bit fixed-point arithmetic, dual-MAC architecture
• 32-bit external bus interface
• Memory
• 32K bytes CPU data RAM
• 24K bytes DSP program RAM
• 8K bytes Bluetooth sequencer and data RAM
• Broad Range of Hardware Communications Peripherals
• Universal Serial Bus (USB) 2.0 On-The-Go
• Two CAN interfaces with 15 message buffers conforming to CAN specification 2.0B active
• Two 8/16-bit SPI, Microwire/Plus serial interfaces
• Four Universal Asynchronous Receiver/Transmitter (UART) channels, one channel has USART capability
• Two CVSD/PCM converters, for supporting two bidirectional audio connections
• External Bus Interface Shared Between CPU and DSP
• 23-bit address bus
• Up to 96M bytes external memory
• General-Purpose Hardware Peripherals
• 16-channel DMA controller
• Dual Versatile Timer Units (VTU), each with four independent timers
• Extensive Power and Clock Management Support
• Two independent oscillators for Active mode (12 MHz) and Power Save mode (32.768 kHz) clocks
• Flexible I/O
• Programmable I/O pin characteristics: TRI-STATE output, push-pull output, weak pullup/pulldown input, high impedance input, high-speed drive capability
• Multi-Input Wake-Up (MIWU) capability…
• Power Supply
• Core logic operation at 1.8V
• Temperature Range
• Packages
• Complete Development Environment
• Multi-file C source editor, source debugger, and project manager
• Bluetooth Protocol Stack
• Transport layer support allows HCI command-based interface over UART port
• Link Manager (LM)
• Service Discovery Protocol (SDP)
• All packet types, piconet, and scatternet functionality