COM Express Compact Type 6 with 11th Generation Intel® Core™ Processor Family (formerly Tiger Lake UP3)

Features ■ 11th Generation Intel® Core™ Processor Family (formerly Tiger Lake UP3) ■ 2 x SODIMM DDR4 3200MHz Memory, up to 32GB (in-band ECC) ■ Intel I225LM Gigabit Ethernet x 1 ■ VGA, 18/24-bit 2ch LVDS/eDP, DDI x 3 ■ High Definition Audio Interface ■ SATA3.0 x 2 ■ USB 2.0 x 8, USB 3.2 10

文件：520.96 Kbytes 页数：2 Pages

AAEON

研扬科技

3.5” SubCompact Board with 12th Generation Intel® Core™ i7/i5/i3/Celeron® Processor SoC

Features ■ Intel® Core i7/i5/i3/Celeron SoC ■ DDR5 4800 MHz, Dual Channel SODIMM x 2, up to 64GB ■ LVDS Dual Channel 18/24 bit x 1, eDP 1.4b, DP1.4a x 1, HDMI 2.1 x 1 ■ 2.5GbE x 1, GbE x 1, SATA III x 1, DIO x 8bit ■ USB 3.2 Gen2 x 3 (Rear I/O), USB2.0 x 4(Pin header), USB Type C x 1 ■ RS-23

文件：572.55 Kbytes 页数：2 Pages

AAEON

研扬科技

COM Express Type 6 with 11th Generation Intel® Xeon/Core™ Processor Family

Features ■ 11th Generation Intel® Core™ Tiger Lake-H Xeon/Core Series Processor ■ Intel 500 Chipset series (RM590E / QM580E) ■ DDR4 3200 MHz SODIMM x 2 (ECC Support), up to 64GB ■ Intel I225LM 2.5GbE x 1 ■ VGA, 18/24-bit 2ch LVDS/eDP, DDIx3 ■ High Definition Audio Interface ■ SATA3.0 x 4

文件：486.85 Kbytes 页数：2 Pages

AAEON

研扬科技

LinxTechnologies
SMD

LinxTechnologies

上传：深圳市宝芯创电子有限公司

NSC
SOP28

NSCNational Semiconductor (TI)

美国国家半导体美国国家半导体公司

上传：深圳市勤思达科技有限公司