包装：散装 类别：连接器，互连器件 同轴连接器（RF）组件 描述：CONN MINI UHF PLUG CRIMP

TE Connectivity Laird

Small Signal Transistor NPN - High Voltage Transistor Chip

PROCESS DETAILS Process EPITAXIAL PLANAR Die Size 20 x 20 MILS Die Thickness 9.0 MILS Base Bonding Pad Area 4.0 x 4.0 MILS Emitter Bonding Pad Area 4.7 x 4.7 MILS Top Side Metalization Al - 30,000Å Back Side Metalization Au - 18,000Å

文件：211.79 Kbytes 页数：2 Pages

Central

Small Signal Transistors NPN - High Voltage Transistor Chip

PROCESS DETAILS Process EPITAXIAL PLANAR Die Size 20 x 20 MILS Die Thickness 7.1 MILS Base Bonding Pad Area 4.0 x 4.0 MILS Emitter Bonding Pad Area 4.7 x 4.7 MILS Top Side Metalization Al - 30,000Å Back Side Metalization Au - 18,000Å

文件：193.04 Kbytes 页数：2 Pages

Central

GERMANIUM PNP TRANSISTORS

文件：2.44311 Mbytes 页数：6 Pages

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