GaAs MMIC

文件：270.6 Kbytes 页数：11 Pages

TRIQUINT

PCS LNA/Mixer Receiver

Qorvo

威讯联合

Small Signal Transistor NPN - Amp/Switch Transistor Chip

PROCESS DETAILS Process EPITAXIAL PLANAR Die Size 13 x 17 MILS Die Thickness 9.0 MILS Base Bonding Pad Area 3.0 X 3.0 MILS Emitter Bonding Pad Area 3.0 X 3.0 MILS Top Side Metalization Al - 30,000Å Back Side Metalization Au - 18,000Å

文件：209.46 Kbytes 页数：2 Pages

CENTRAL

Small Signal Transistors NPN - Amp Switch Transistor Chip

PROCESS DETAILS Process EPITAXIAL PLANAR Die Size 13 x 17 MILS Die Thickness 7.1 MILS Base Bonding Pad Area 3.0 X 3.0 MILS Emitter Bonding Pad Area 3.0 X 3.0 MILS Top Side Metalization Al - 30,000Å Back Side Metalization Au - 18,000Å

文件：191.02 Kbytes 页数：2 Pages

CENTRAL

Cylindrical Photoelectric Sensor

文件：568.61 Kbytes 页数：4 Pages

PANASONIC

松下