首页>CLB1C5C2R7K1000TC1>规格书详情
CLB1C5C2R7K1000TC1中文资料村田数据手册PDF规格书
相关芯片规格书
更多- CLB1C5C1R3K1000TC1
- CLB1C261UAEWD0-00
- CLB1C502UDEWA0-00G
- CLB1C5C1R0K1000TC1
- CLB1B6U7R5K1000TC1
- CLB1C5C2R4K1000TC1
- CLB1C5C1R5K1000TC1
- CLB1C5C1R1K1000TC1
- CLB1C5C1R6K1000TC1
- CLB1C5C1R8K1000TC1
- CLB1C5C2R0K1000TC1
- CLB1C5C1R2K1000TC1
- CLB1C5C2R2K1000TC1
- CLB1C5C2R2K1000TC1
- CLB1C5C2R4K1000TC1
- CLB1B6U7R5K1000TC1
- CLB1B6U6R8K1000TC1
- CLB1C5C2R4K1000TC1
CLB1C5C2R7K1000TC1规格书详情
1. Fine grained high-density ceramic dielectric, pure
gold electrode and simple single layer structure
provide very reliable performance and excellent
frequency characteristics.
2. A wide selection of sizes from very miniature
0.25mm square is suited to high-density mounting.
3. For compatibility with the gold electrodes, die
bonding with Au-Sn is possible and wire bonding
with gold wire is possible.
4. To improve handling of bonding, Au-Sn coating is
available on one side or both sides.
5. Custom made type (dimensions, cap. values, etc.)
are also available upon request.
Applications
1. Microwave Integrated Circuits
2. Microwave Devices
3. Optical Devices
4. Measuring Equipments
供应商 | 型号 | 品牌 | 批号 | 封装 | 库存 | 备注 | 价格 |
---|---|---|---|---|---|---|---|
General Devices |
20 |
公司优势库存 热卖中!! |
询价 | ||||
HXHL |
22+ |
SOP8 |
8900 |
全新正品现货 有挂就有现货 |
询价 | ||
IR |
23+ |
NA |
8000 |
专注配单,只做原装进口现货 |
询价 | ||
CARLING |
24+ |
NA/ |
100 |
优势代理渠道,原装正品,可全系列订货开增值税票 |
询价 | ||
SANREX/三社 |
23+ |
MODULE |
10000 |
原厂授权一级代理,专业海外优势订货,价格优势、品种 |
询价 | ||
SANREX |
专业模块 |
MODULE |
8513 |
模块原装主营-可开原型号增税票 |
询价 | ||
IR |
23+ |
NA |
8000 |
只做原装现货 |
询价 | ||
CARLING |
23+ |
DIP |
50000 |
全新原装正品现货,支持订货 |
询价 | ||
SANRES |
23+ |
模块 |
450 |
全新原装正品,量大可订货!可开17%增值票!价格优势! |
询价 | ||
Hammond |
2020+ |
N/A |
155 |
加我qq或微信,了解更多详细信息,体验一站式购物 |
询价 |