CLB1AB5121K1000TC1中文资料村田数据手册PDF规格书

1. Fine grained high-density ceramic dielectric, pure

gold electrode and simple single layer structure

provide very reliable performance and excellent

frequency characteristics.

2. A wide selection of sizes from very miniature

0.25mm square is suited to high-density mounting.

3. For compatibility with the gold electrodes, die

bonding with Au-Sn is possible and wire bonding

with gold wire is possible.

4. To improve handling of bonding, Au-Sn coating is

available on one side or both sides.

5. Custom made type (dimensions, cap. values, etc.)

are also available upon request.

Applications

1. Microwave Integrated Circuits

2. Microwave Devices

3. Optical Devices

4. Measuring Equipments