Multi Layer Ceramic Capacitor

文件：166.49 Kbytes 页数：1 Pages

SAMSUNGEM

三星

Multi Layer Ceramic Capacitor

文件：166.47 Kbytes 页数：1 Pages

SAMSUNGEM

三星

Multi Layer Ceramic Capacitor

文件：166.95 Kbytes 页数：1 Pages

SAMSUNGEM

三星

包装：散装 类别：传感器，变送器 磁体 - 多用途 描述：MAGNET RECTANGULAR

Carlo Gavazzi Inc.

丝印：CL3861Q1；Package：TSSOP；LOW-VOLTAGE 10-BIT FET BUS SWITCH

Qualified for Automotive Applications 5-Ω Switch Connection Between Two Ports Rail-to-Rail Switching on Data I/O Ports Ioff Supports Partial-Power-Down Mode Operation Flowthrough Architecture Optimizes PCB Layout Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II description/orde

文件：340.93 Kbytes 页数：12 Pages

TI

德州仪器

丝印：CL3861Q1；Package：TSSOP；LOW-VOLTAGE 10-BIT FET BUS SWITCH

Qualified for Automotive Applications 5-Ω Switch Connection Between Two Ports Rail-to-Rail Switching on Data I/O Ports Ioff Supports Partial-Power-Down Mode Operation Flowthrough Architecture Optimizes PCB Layout Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II description/orde

文件：340.93 Kbytes 页数：12 Pages

TI

德州仪器

丝印：CL3861Q1；Package：TSSOP；LOW-VOLTAGE 10-BIT FET BUS SWITCH

Qualified for Automotive Applications 5-Ω Switch Connection Between Two Ports Rail-to-Rail Switching on Data I/O Ports Ioff Supports Partial-Power-Down Mode Operation Flowthrough Architecture Optimizes PCB Layout Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II description/orde

文件：340.93 Kbytes 页数：12 Pages

TI

德州仪器

丝印：CL3861Q1；Package：TSSOP；LOW-VOLTAGE 10-BIT FET BUS SWITCH

Qualified for Automotive Applications 5-Ω Switch Connection Between Two Ports Rail-to-Rail Switching on Data I/O Ports Ioff Supports Partial-Power-Down Mode Operation Flowthrough Architecture Optimizes PCB Layout Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II description/orde

文件：340.93 Kbytes 页数：12 Pages

TI

德州仪器

丝印：CL331H；Package：TSSOP；RF430CL331H NFC Type 4B Dynamic Dual Interface Transponder

1.1 Features 1 • Pass-Through Operation Sends Data Updates and Requests to Host Controller • I2C Interface Allows Writing and Reading of Internal SRAM • Prefetching, Caching, and Auto ACK Features Increase Data Throughput • Enables Data Streaming • All RF Communication up to Layer 4 Handle

文件：1.07801 Mbytes 页数：63 Pages

TI

德州仪器

丝印：CL331H；Package：TSSOP；RF430CL331H NFC Type 4B Dynamic Dual Interface Transponder

1.1 Features 1 • Pass-Through Operation Sends Data Updates and Requests to Host Controller • I2C Interface Allows Writing and Reading of Internal SRAM • Prefetching, Caching, and Auto ACK Features Increase Data Throughput • Enables Data Streaming • All RF Communication up to Layer 4 Handle

文件：1.07801 Mbytes 页数：63 Pages

TI

德州仪器